576Mb: x18, x36 RLDRAM 3 Features RLDRAM 3 MT44K32M18 2 Meg x 18 x 16 Banks MT44K16M36 1 Meg x 36 x 16 Banks 1 Options Marking Features t Clock cycle and RC timing 1066 MHz DDR operation (2133 Mb/s/ball data t 0.93ns and RC (MIN) = 7.5ns -093F rate) (RL3-2133) 76.8 Gb/s peak bandwidth (x36 at 1066 MHz clock t 0.93ns and RC (MIN) = 8ns -093E frequency) (RL3-2133) Organization t 1.07ns and RC (MIN) = 8ns -107E 32 Meg x 18, and 16 Meg x 36 common I/O (CIO) (RL3-1866) 16 banks t 1.25ns and RC (MIN) = 8ns -125F 1.2V center-terminated push/pull I/O (RL3-1600) 2.5V V , 1.35V V , 1.2V V I/O t EXT DD DDQ 1.25ns and RC (MIN) = 10ns -125E t Reduced cycle time ( RC (MIN) = 7.5 - 12ns) (RL3-1600) SDR addressing t 1.25ns and RC (MIN) = 12ns -125 Programmable READ/WRITE latency (RL/WL) and (RL3-1600) burst length Configuration Data mask for WRITE commands 32 Meg x 18 32M18 Differential input clocks (CK, CK ) 16 Meg x 36 16M36 Free-running differential input data clocks (DKx, Operating temperature DKx ) and output data clocks (QKx, QKx ) Commercial (T = 0 to +95C) None C On-die DLL generates CK edge-aligned data and Industrial (T = 40C to +95C) IT C differential output data clock signals Package 64ms refresh (128K refresh per 64ms) 168-ball BGA (Pb-free) RB 168-ball BGA package Revision :A / :B or 60 matched impedance outputs 1. Not all options listed can be combined to Note: Integrated on-die termination (ODT) define an offered product. Use the part cat- Single or multibank writes alog search on www.micron.com for availa- Extended operating range (2001066 MHz) ble offerings. READ training register Multiplexed and non-multiplexed addressing capa- bilities Mirror function Output driver and ODT calibration JTAG interface (IEEE 1149.1-2001) 09005aef84003617 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 576mb rldram3.pdf - Rev. L 1/19 EN 2016 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.576Mb: x18, x36 RLDRAM 3 Features Figure 1: 576Mb RLDRAM 3 Part Numbers Example Part Number: MT44K16M36RB-093E:B -: MT44K Configuration Package Speed Temp Rev. Revision Rev. / :B :A Configuration 32 Meg x 18 32M18 Temperature 16 Meg x 36 16M36 None Commercial IT Industrial Package Speed Grade 168-ball BGA (Pb-free) RB t t -093F CK = 0.93ns (7.5ns RC) t t CK = 0.93ns (8ns RC) -093E t t CK = 1.07ns (8ns RC) -107E t t -125F CK = 1.25ns (8ns RC) t t -125E CK = 1.25ns (10ns RC) t t -125 CK = 1.25ns (12ns RC) BGA Part Marking Decoder Due to space limitations, BGA-packaged components have an abbreviated part marking that is different from the part number. Microns BGA Part Marking Decoder is available on Microns Web site at www.micron.com. 09005aef84003617 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 576mb rldram3.pdf - Rev. L 1/19 EN 2016 Micron Technology, Inc. All rights reserved.