128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM Features Mobile Low-Power SDR SDRAM MT48H8M16LF 2 Meg x 16 x 4 banks MT48H4M32LF 1 Meg x 32 x 4 banks Options Marking Features V /V : 1.8V/1.8V H DD DDQ V /V = 1.71.95V DD DDQ Addressing Fully synchronous all signals registered on positive Standard addressing option LF edge of system clock Configuration Internal, pipelined operation column address can 8 Meg x 16 (2 Meg x 16 x 4 banks) 8M16 be changed every clock cycle 4 Meg x 32 (1 Meg x 32 x 4 banks) 4M32 Plastic green packages 4 internal banks for concurrent operation 1 54-ball VFBGA (8mm x 8mm) B4 Programmable burst lengths (BL): 1, 2, 4, 8, and con- 2 90-ball VFBGA (8mm x 13mm) B5 tinuous Timing: cycle time Auto precharge, includes concurrent auto precharge 6ns at CL = 3 -6 Auto refresh and self refresh modes 7.5ns at CL = 3 -75 LVTTL-compatible inputs and outputs Operating temperature range On-chip temperature sensor to control self refresh Commercial (0C to +70C) None rate Industrial (40C to +85C) IT Revision :K Partial-array self refresh (PASR) Deep power-down (DPD) 1. Available only for x16 configuration. Notes: Selectable output drive strength (DS) 2. Available only for x32 configuration. 64ms refresh period Table 1: Configuration Addressing Architecture 8 Meg x 16 4 Meg x 32 Number of banks 4 4 Bank address balls BA0, BA1 BA0, BA1 Row address balls A 11:0 A 11:0 Column address balls A 8:0 A 7:0 Table 2: Key Timing Parameters Clock Rate (MHz) Access Time Speed Grade CL = 2 CL = 3 CL = 2 CL = 3 -6 104 166 8ns 5ns -75 104 133 8ns 5.4ns Note: 1. CL = CAS (READ) latency PDF: 09005aef832ff1ea Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 128mb mobile sdram y35M.pdf - Rev. G 10/09 EN 2008 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM Features Figure 1: 128Mb Mobile LPSDR Part Numbering MT 48 H 8M16 LF B4 -6 IT :K Micron Technology Revision :K Product Family 48 = Mobile SDR SDRAM Operating Temperature Blank = Commercial (0C to +70C) Operating Voltage IT = Industrial (40C to +85C) H = 1.8V/1.8V Cycle Time t Configuration -6 = 6ns, CK CL = 3 t 8 Meg x 16 -75 = 7.5ns, CK CL = 3 4 Meg x 32 Package Codes Addressing B4 = 8mm x 8mm VFBGA green LF = Mobile standard addressing B5 = 8mm x 13mm VFBGA green FBGA Part Marking Decoder Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the part number. Microns FBGA part marking decoder is available at www.micron.com/decoder. PDF: 09005aef832ff1ea Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 128mb mobile sdram y35M.pdf - Rev. G 10/09 EN 2008 Micron Technology, Inc. All rights reserved.