EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX17572 4.5V60V, 1A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensation General Description Benefits and Features The MAX17572 high-efficiency, high-voltage, synchronous Reduces External Components and Total Cost step-down DC-DC converter with integrated MOSFETs No Schottky-Synchronous Operation operates over a 4.5V to 60V input. The converter can Internal Compensation for Any Output Voltage deliver up to 1A and generates output voltages from 0.9V All-Ceramic Capacitors, Compact Layout up to 0.9 x V . The feedback (FB) voltage is accurate to IN Reduces Number of DC-DC Regulators to Stock within 1.2% over -40C to +125C. The MAX17572 uses Wide 4.5V to 60V Input peak current-mode control. Adjustable 0.9V to 0.9 x V Output IN The device is available in a 12-pin (3mm x 3mm) TDFN Continuous 1A Current Over Temperature package. Simulation models are available. 400kHz to 2.2MHz Adjustable Switching Frequency with External Synchronization Applications Reduces Power Dissipation Industrial Control Power Supplies Peak Efficiency > 92% General-Purpose Point-of-Load Auxiliary Bootstrap LDO for Improved Efficiency Distributed Supply Regulation 4.65A Shutdown Current Base Station Power Supplies Operates Reliably in Adverse Industrial Environments Wall Transformer Regulation Hiccup Mode Overload Protection High-Voltage, Single-Board Systems Adjustable Soft-Start Built-In Output-Voltage Monitoring with RESET Programmable EN/UVLO Threshold Monotonic Startup into Prebiased Load Overtemperature Protection High Industrial -40C to +125C Ambient Operating Temperature Range/-40C to +150C Junction Temperature Range Ordering Information appears at end of data sheet. 19-8640 Rev 3 5/18MAX17572 4.5V60V, 1A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensaton Absolute Maximum Ratings V to PGND .........................................................-0.3V to +65V V to GND .........................................................-0.3V to +6.5V IN CC EN/UVLO to GND.........................................-0.3V to V + 0.3V LX Total RMS Current ........................................................1.6A IN EXTV to GND ...................................................-0.3V to +26V Continuous Power Dissipation (T = +70C) CC A BST to PGND ........................................................-0.3V to +70V (derate 24.4mW/C above +70C) (Multilayer board) ..1951mW LX to PGND................................................-0.3V to (V + 0.3)V Output Short-Circuit Duration ....................................Continuous IN BST to LX .............................................................-0.3V to +6.5V Junction Temperature ......................................................+150C BST to V ...........................................................-0.3V to +65V Storage Temperature Range ............................ -65C to +160C CC RESET, SS, RT/SYNC to GND ............................-0.3V to +6.5V Lead Temperature (soldering, 10s) .................................+300C PGND to GND ......................................................-0.3V to +0.3V Soldering Temperature (reflow) .......................................+260C FB to GND ............................................................-0.3V to +1.5V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Junction temperature greater than +125C degrades operating lifetimes. Package Information PACKAGE TYPE: 12 TDFN Package Code TD1233+1C Outline Number 21-0664 Land Pattern Number 90-0397 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8.5C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = V = 24V, R = 40.2k, C = 2.2F, V = V = EXTVCC = 0, LX = SS = RESET = OPEN, V to V = 5V, IN EN/UVLO RT VCC PGND GND BST LX V = 1V, T = -40C to 125C, unless otherwise noted. Typical values are at T = +25C. All voltages are referenced to GND, unless FB A A otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY (V ) IN Input Voltage Range V 4.5 60 V IN Input Shutdown Current I V = 0V (shutdown mode) 4.65 7.25 A IN-SH EN/UVLO Normal switching mode, f = 500kHz, SW Input Quiescent Current I 5.2 mA Q PWM V = 0.8V, EXTV = GND FB CC ENABLE/UVLO (EN) V V rising 1.19 1.215 1.26 V ENR EN/UVLO EN/UVLO Threshold V V falling 1.068 1.09 1.131 V ENF EN/UVLO EN/UVLO Input Leakage I V = 1.25V, T = 25C -50 +50 nA ENLKG EN/UVLO A Current Maxim Integrated 2 www.maximintegrated.com