MPXV7007 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. 4 26 January 2021 Product data sheet 1 General description The MPXV7007 series piezoresistive transducers are monolithic silicon pressure sensors. The MPXV7007 is designed for a wide range of applications, particularly applications employing a microcontroller, or microprocessor with analog-to-digital inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. 2 Features and benefits Ideally suited for microprocessor or microcontroller-based systems Temperature compensated over 40 C to +125 C Thermoplastic (PPS) surface mount package Patented silicon shear stress strain gauge Available in differential and gauge configurations 3 Applications Hospital beds HVAC Respiratory systems Process control 4 Ordering information Table 1.Ordering information Type number Package Name Description Version MPXV7007DP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-1 7.62 mm body MPXV7007GC6U SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67 mm x 10.67 mm x SOT1854-1 12.96 mm body MPXV7007GP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-3 8.38 mm bodyNXP Semiconductors MPXV7007 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 4.1 Ordering options Table 2.Ordering options of Ports Pressure type Package SOT Device Device name options no. marking None Single Dual Gauge Differential Absolute Small Outline Package MPXV7007DP Trays 1693-1 MPXV7007DP MPXV7007DPT1 Tape and Reel 1693-1 MPXV7007DP MPXV7007GC6U Rails 1854-1 MPXV7007G MPXV7007GC6T1 Tape and Reel 1854-1 MPXV7007G MPXV7007GP Trays 1693-3 MPXV7007GP Small outline packages MPXV7007DP/DPT1 MPXV7007GC6U/C6T1 MPXV7007GP CASE 1351-01 CASE 482A-01 CASE 1369-01 SOT1693-1 SOT1854-1 SOT1693-3 5 Block diagram V S 2 THIN FILM GAIN STAGE 2 TEMPERATURE AND 4 Sensing COMPENSATION GROUND V out element AND REFERENCE GAIN STAGE 1 SHIFT CIRCUITRY 3 Pins 1, 5, 6, 7 and 8 are NO CONNECTS for small outline package device GND aaa-040606 Figure 1.Integrated pressure sensor schematic MPXV7007 All information provided in this document is subject to legal disclaimers. NXP B.V. 2021. All rights reserved. Product data sheet Rev. 4 26 January 2021 2 / 19