ISM330DLC Datasheet iNEMO inertial module: 3D accelerometer and 3D gyroscope with digital output for industrial applications Features 3D accelerometer with selectable full scale: 2/4/8/16 g 3D gyroscope with selectable full scale: 125/250/500/1000/2000 dps LGA-14L Analog supply voltage: 1.71 V to 3.6 V (2.5 x 3.0 x 0.83 mm) typ. SPI & IC serial interface with main processor data synchronization Dedicated gyroscope output chain with low latency, low noise and dedicated low-pass filters for control loop stability (OIS and other stabilization applications) Auxiliary SPI serial interface for independent, low-noise low-latency data output for gyroscope and accelerometer Ultra-low power consumption for both accelerometer and gyroscope enabling long-lasting battery-operated applications: 0.5 mA in combo normal mode and 0.75 mA in combo high-performance mode Smart FIFO up to 4 kbyte Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click Sensor hub feature to efficiently collect data from additional external sensors Embedded hard, soft ironing for external magnetic sensor corrections Embedded temperature sensor Embedded self-test both for gyroscope and accelerometer High shock survivability Extended operating temperature range (-40 C to +85 C) ECOPACK , RoHS and Green compliant Product status link ISM330DLC Applications Product summary Industrial IoT and connected devices Antennas, platforms, and optical image and lens stabilization Order code ISM330DLCTR Robotics, drones and industrial automation Temperature range -40 to +85 C Navigation systems and telematics LGA-14L Vibration monitoring and compensation Package (2.5 x 3.0 x 0.83 mm) Packing Tape and reel Description The ISM330DLC is a system-in-package featuring a high-performance 3D digital Product label accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications. STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. In the ISM330DLC the sensing element of the accelerometer and of the gyro are implemented on the same silicon die, thus guaranteeing superior stability and robustness. DS12171 - Rev 3 - November 2018 www.st.com For further information contact your local STMicroelectronics sales office.ISM330DLC The ISM330DLC has a full-scale acceleration range of 2/4/8/16 g and an angular rate range of 125/250/500/1000/2000 dps. Delivering high accuracy and stability with ultra-low power consumption (0.75 mA in high-performance, combo mode) enables, also in the industrial domain, long-lasting battery-operated applications. The ISM330DLC includes a dedicated configurable signal processing path with low latency, low noise and dedicated filtering specifically intended for control loop stability. Data from this dedicated signal path can be made available through an auxiliary SPI interface, configurable for both the gyroscope and accelerometer. High- performance, high-quality, small size and low power consumption together with high robustness to mechanical shock makes the ISM330DLC the preferred choice of system designers for the creation and manufacturing of versatile and reliable products. The ISM330DLC is available in a plastic, land grid array (LGA) package. DS12171 - Rev 3 page 2/116