solutions MAXIMUM Mill-Max Expands its Line of Receptacles with Organic Fibre Plug Solder Barrier -- 14 Styles Offered, Tape & Reel Packaged Mill-Maxs organic fibre plug (OFP) solder barrier receptacles are discrete sockets for through-hole soldering into printed circuit boards. These open bottom receptacles are fitted with organic fibre plugs to prevent solder, paste or flux from contaminating the internal contact during the placing and soldering process. When the device/mating lead is plugged into the receptacle the OFP is knocked out allowing the mating lead to pass through the fingers of the internal contact and make a reliable electrical connection. 14 sizes/styles are now available, 13 have standard tape & reel packaging. The advantage of tape & reel packaging for these receptacles is it permits through- hole components to be placed simultaneously with surface mount parts on pick-n-place assembly lines eliminating the need to hand place the receptacles in an additional manufacturing step. The OFP barrier permits the sockets to be vacuum picked from the tape prior to placement in a hole in the circuit board. The knock-out-bottom feature enables these sockets to be made relatively short compared to many similar receptacles. The reduced length provides two advantages: the receptacles can stand upright and stable in a carrier tape pocket and the protrusion through the PCB is minimal especially important when working with SMT boards. The open bottom recep- tacle design eliminates the need to trim long device leads that would otherwise bottom out in a closed receptacle design and also makes them ideal for low profile board stacking applications via the ability to pass through. The OFP parts are available as discrete receptacles and can be supplied in bulk or on carrier tape per EIA-481 for industry standard pick and place machines. All Mill-Max receptacles use a precision-machined brass housing with a press-fit beryllium copper multi-finger contact. (Intrusive reflow (also calledpin-in-past) is a technique of using conventional through-hole components in a reflow soldering process. The receptacles are placed into plated-through-holes in the circuit board (solder paste has previously been screen printed on pads adja- cent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-through-holes and achieve solder joints as reliable as wave soldering. The OFP barrier prevents solder paste from being picked-up inside the contact dur- ing pick n place assembly.Overprintin paste on the solder mask can be used to adjust the volume of paste required to fill each hole.) Visit www.mill-max.com/PR626 for more information. R Mill-Max Mfg. Corp. 190 Pine Hollow Road, Oyster Bay, NY 11771-0300 516-922-6000 Fax: 516-922-9253 www.mill -max.com Maximum Interconnect Solutions (1-12 -- 626)D E N I H N PIN RECEPTACLES With Organic Fibre Plug Solder Barrier PINS (see specific contact range on pages 216, 217 & 219) These through-hole (tubular) receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG barrier prevents solder, paste or flux from contaminating the spring contact. After soldering, the OFP barrier is pushed out of the recep- tacle when the device is plugged in. All parts are available as discrete receptacles but for SMT assembly, certain receptacles are supplied on carrier tape per EIA-481 to feed industry standard pick and place machines. *Intrusive reflow (also calledpin-in-past) is a technique of using conventional through-hole components in a reflow soldering process. The receptacles are placed into plated through-holes in the circuit board (solder paste has previous- ly been screen printed on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated through-holes and achieve solder joints as reliable as wave soldering. The OFP barrier prevents solder paste from being picked-up inside the contact during pick n place assembly.Overprintin paste on the solder mask can be used to adjust the volume of paste required to fill each hole. 5359 0577 4015 .068 DIA048 DIA058 DIA020 .010 .025 .052 DIA086 .038 DIA060 .089 .100 .040 DIA100 .071 .043 DIA028 DIA031 DIA009 .009 .009 5359-0-XX-XX-10-XX-10-0 0577-0-XX-XX-21-XX-10-0 4015-0-XX-XX-30-XX-10-0 Solder mount in .043.003 PTH. Solder mount in .045.003 PTH. Solder mount in .057.003 PTH. 10 Contact for .012-.017 pins. 21 Contact for .015-.022 pins. 30 Contact for .015-.025 pins. Also available on 16mm wide carrier Also available on 12mm wide carrier Also available on 8mm wide carrier tape: 3,000 parts per 13 reel. tape: 3,000 parts per 13 reel. tape: 5,500 parts per 13 reel. SPECIFICATIONS ORDER CODE: XXXX - 0 - XX - XX - XX - XX -XX - 0 SHELL MATERIAL: Brass Alloy 360, 1/2 Hard BASIC PART CONTACT MATERIAL: SPECIFY PACKAGING: SPECIFY CONTACT FINISH: Beryllium Copper Alloy 172, HT 43 Discrete Receptacles 27 30 GOLD OVER NICKEL (RoHS) SOLDER BARRIER: 67 Supplied on 13 Reels 02 100 TIN/LEAD OVER NICKEL Organic Fibre Plug DIMENSION IN INCHES SPECIFY SHELL FINISH: 84 100 TIN OVER NICKEL (RoHS) TOLERANCES ON: 01 200 TIN/LEAD OVER NICKEL LENGTHS: .005 RoHS 80 200 TIN OVER NICKEL (RoHS) CONTACT 2002/95/EC DIAMETERS: .002 ANGLES: 2 10, 21 or 30 CONTACT (DATA ON PAGES 216, 217 & 219) www.mill-max.com 516-922-6000 164 O C I A S I M C E R P