ProductNumber:510-93-068-10-041001 Description: PGA Socket Solder Tail PGA Socket Through Hole PlatingCode: 93 ShellPlating: 200 Tin/Lead(93/7) over 100 Nickel InnerContactPlating: 30 Gold over 50 Nickel 068-10-041 10X10 Mill-Max RoHS Of Part Compliant Pins Number 68 510-93-068-10-041001 CONTACT: Contact Used: 32, Low Force 6 Finger Contact CurrentRating= 3 Amps BERYLLIUMCOPPERALLOY 172 (UNS C17200) per ASTM B 194 PropertiesofBERYLLIUMCOPPER: Chemical composition: Cu 98.1%, Be 1.9% Temper as stamped: TD01 Properties after heat treatment (TH01): Hardness: 36-43 Rockwell C Mechanical Life: 1000 Cycles Min. Density: .298 lbs/in3 Electrical Conductivity: 22% IACS* Resistance: 10 miliohms Max Operating Temperature: -55C/+125C Melting point: 980C/865C (liquidus/solidus) Stress Relaxation: 96% of stress remains after 1,000 hours 100 C 70% of stress remains after 1,000 hours 200 C *International Annealed Copper Standard, i.e. as a % of pure copper. Since BeCu loses its spring properties over time at high temperatures it is rated for continuous use up to 150C. For applications up to 300C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info. LOOSEPIN: Pin Used: 1001 (Brass Alloy) Mill-Max Mfg. Corp. Datasheet Last Modified 3/29/2018 Page 1 of 3BRASSALLOY 360 per ASTM B 16, or 385 per ASTM B455 PropertiesofBRASSALLOY360ASTMB16: Chemical composition: Cu 63% (max), Pb 3.7% (max), Fe .35% (max), Zn remainder Temper as machined: H02/H04 Yield Strength: 25-45 ksi Tensile strength: 57-80 ksi Hardness as machined: 80-90 Rockwell B Electrical conductivity: 26% IACS* Melting point: 1000C/840C (liquidus/solidus) PropertiesofBRASSALLOY385ASTMB455: Chemical composition: Cu 60% (max), Pb 3.5% (max), Fe .35% (max), Zn remainder Temper as machined: H02/H04 Yield Strength: 16 ksi(min) Tensile strength: 48 ksi(min) Hardness as machined: 80-90 Rockwell B Electrical conductivity: 28% IACS* Melting point: 1000C/840C (liquidus/solidus) After machining, brass parts are often annealed (softened) for subsequent bending, swaging or crimping. A partial anneal down to 6010 RB is recommended for 90 bends, a full anneal down to 3515 RB is recommended for pins or terminals that are swaged (riveted) to a circuit board or crimped to a wire. RoHS-2 directive 2011/65/EU, exemption 6c allows up to 4% lead as an alloy agent in copper. *International Annealed Copper Standard, i.e. as a % of pure copper. INSULATORINFORMATION: PCT Polyester, (Thermx CG933, black) High Temperature PropertiesofPCTPolyester: Brand: Thermx Grade: CG-933 Rated voltage: 100 VRMS/150 VDC Insulation resistance: 10,000 Megaohms min. Material Heat Deflection Temp (per ASTM D 648): 529F (276C) 66 psi Dielectric strength: 1000 VRMS min. (700 VRMS min. for series 117 Shrink DIP) Note: Materials above 446F (230C) are considered suitable foreutecti reflow soldering, above 500F (260C) forlead-fre reflow soldering. CertificateofCompliance: This is to Certify that the product described above is manufactured to Mill-Max quality standards in accordance with all applicable specifications and drawing. Mill-Max certifies this product to be free from defects of materials and workmanship. This Certificate of Compliance covers the following requirements: Dimensional (all features verified to be within tolerances described on the applicable drawing). Raw Material (materials and properties verified to be as described on the applicable drawing). Plating (platings as required, thickness verified, and performance including solderability per mil-standard). Performance (insertion extraction or other force requirements as described on the applicable drawing). ComplianceStatementforRegistration,Evaluation,AuthorizationandRestrictionofChemicals(REACH) Reference: 1. Regulation EC No 1907/2006 of the European Parliament and of the Council of 18 December 2006, concerning the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) 2. ECHA, Candidate list of Substances of Very High Concern (SVHC)