PRODUCT SPECIFICATION DUAL SIM FRAME, 1.37MM HEIGHT, POP OUT 1.0 SCOPE This Product Specification covers the performance requirements of the SIM Card Connector frame and the SIM Card Connector (Block SIM). (This part is a frame only, it must be used together with Molex 0.32mm block SIM 151058 & 151059 for an entire SIM pop out system) 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER(S) Product Name Series Number DUAL SIM FRAME, 1.37MM HT., POP OUT 151050 MICRO BLOCK SIM CONNECTOR 151058 NANO BLOCK SIM CONNECTOR 151059 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS See Sales Drawing SD-151050-0001, SD-151058-0001 and SD-151059-0001 for information on dimensions, materials, platings and markings. TENTATIVE RELEASE: THIS SPECIFICATION IS BASED ON DESIGN OBJECTIVES AND IS STRICTLY TENTATIVE. PRELIMINARY TEST DATA MAY EXIST, BUT THIS SPECIFICATION IS SUBJECTED TO CHANGE BASED ON THE RESULTS OF ADDITIONAL TESTING AND EVALUATION. REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. DUAL SIM FRAME EC No: S2015-1156 1.37MM HEIGHT, POP OUT 1 of 9 1 DATE: 2015/04/13 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: GMENARLY 2015/04/13 JTAN 2015/05/28 VICTOR LIM 2015/05/28 PS-151050-0001 TEMPLATE FILENAME: PRODUCT SPEC SIZE A (V.2).DOC PRODUCT SPECIFICATION 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS The following documents form a part of this specification to the extended specified herewith. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. 4.0 RATINGS 4.1 CURRENT RATING 0.5Amps Max. per contact 4.2 VOLTAGE RATING 10 Volt DC Max. 4.3 TEMPERATURE Operating: - 30C to + 85C 5.0 MECHANICAL INTERFACE 5.1 CARD INTERFACE SIM card interface: GSM 11.11 specification 5.2 PWB INTERFACE Plating on PWB pads: OSP plated 6.0 PERFORMANCE 6.1 ELECTRICAL REQUIREMENTS ITEM DESCRIPTION TEST CONDITION REQUIREMENT 1. Mate connectors with dry circuit (20 Contact Resistance: Low Level mV, 100mA MAX) on mated connector. a. Terminal: Contact (EIA-364-23C) 100 milliohms Max. 1 Resistance b. Detect pin: (LLCR) 2. Between detect spring & detect contact 100 milliohms Max. on shell. Unmated connectors: apply a voltage of Insulation 500 VDC between adjacent contact for 1 100 Megaohms Min 2 Resistance minutes Unmated connectors: apply a voltage of Dielectric 1000 VAC between adjacent contact for 3 Withstanding No voltage breakdown 1 minutes Voltage (EIA-364-20C) REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. DUAL SIM FRAME EC No: S2015-1156 1.37MM HEIGHT, POP OUT 2 of 9 1 DATE: 2015/04/13 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: GMENARLY 2015/04/13 JTAN 2015/05/28 VICTOR LIM 2015/05/28 PS-151050-0001 TEMPLATE FILENAME: PRODUCT SPEC SIZE A (V.2).DOC