This document was generated on 09/13/2021 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 0444280801 Status: Active Overview: Micro-Fit Connector System Description: Micro-Fit BMI Header, Surface Mount Compatible, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, Tin (Sn) Plating Documents: 3D Model (PDF) Test Summary 444280001-TS-000 (PDF) 3D Model Datasheet (PDF) Drawing (PDF) Symbol Footprint Data SYM-44428-0801-001 (PDF) Product Specification PS-44300-001-001 (PDF) Symbol Footprint Data SYM-44428-08013-001 (PDF) Series image - Reference only Packaging Specification PK-44428-001-001 (PDF) RoHS Certificate of Compliance (PDF) EU ELV Agency Certification Not Relevant CSA LR19980 EU RoHS China RoHS UL E29179 Compliant General REACH SVHC Product Family PCB Headers Contained Per - Series 44428 D(2021)4569-DC (8 Application Board-to-Board, Power, Wire-to-Board July 2021) Comments High Temperature Square Pin Solder Type Polarized to Benzo(ghi)perylene Mating Part Octanoic acid, Overview Micro-Fit Connector System 2,2,3,3,4,4,5,5,6,6,7,7,8,8,8- Product Name Micro-Fit BMI pen UPC 800756081656 Dodecamethylcyclohexasiloxane Decamethylcyclopentasiloxane Physical Octamethylcyclotetrasiloxane Breakaway No Disodium 3,3 - 1,1 - Circuits (Loaded) 8 Biphenyl -4,4 - Circuits (maximum) 8 Diylbis(Azo) Color - Resin Black 1,2- Durability (mating cycles max) 30 Benzenedicarboxylic First Mate / Last Break No acid, bis(3- Flammability 94V-0 methylbutyl) Glow-Wire Capable No 1,2-diethoxyethane Guide to Mating Part No Dibutyltin-dichloride Keying to Mating Part None C.I. Direct Black 38 Lock to Mating Part Yes Ammonium- Material - Metal Brass pentadecafluorooctanoate Material - Plating Mating Tin Phenol, 2-(2H- Material - Plating Termination Tin benzotriazol-2-yl)-4,6- Material - Resin High Temperature Thermoplastic bis(1,1-dim Net Weight 2.069/g 2-ethylhexyl 10- Number of Rows 2 ethyl-4,4-dioctyl-7- Orientation Right Angle oxo-8-oxa-3, PC Tail Length 3.50mm Dibutylbis(pentane-2,4- PCB Locator Yes dionato-O,O )tin PCB Retention Yes 2-(2H-Benzotriazol-2- PCB Thickness - Recommended 1.60mm yl)-4,6- Packaging Type Tray ditertpentylphenol Pitch - Mating Interface 3.00mm 2-(2H-Benzotriazol-2- Plating min - Mating 5.080m yl)-4-(tert-butyl)-6- Plating min - Termination 5.080m (sec-b Polarized to PCB Yes 1,2- Shrouded Fully Benzenedicarboxylic Stackable NoSurface Mount Compatible (SMC) Yes acid, dihexyl ester, Temperature Range - Operating -40 to +105C bra Termination Interface: Style Through Hole diisohexyl phthalate 1,2- Electrical Benzenedicarboxylic Current - Maximum per Contact 8.5A acid, dipentyl ester, br Voltage - Maximum 600V Zirconia Aluminosilicate Solder Process Data Refractory Ceramic Duration at Max. Process Temperature (seconds) 005 Fibr Lead-freeProcess Capability WAVE Nonadecafluorodecanoic Max. Cycles at Max. Process Temperature 001 acid (PFDA) and its Process Temperature max. C 260 sodiu Tris(4-nonylphenyl, Material Info branched and linear) Reference - Drawing Numbers phosphi Packaging Specification PK-44428-001-001 Perfluorobutane Product Specification PS-44300-001-001 sulfonic acid (PFBS) Sales Drawing SD-44428-001-001 and its sal Symbol/Footprint Data SYM-44428-0801-001, SYM-44428-0801 3-001 Fluoranthene Test Summary 444280001-TS-000 Pyrene Dodecachloropentacyclo 12.2.1.16,9.02,13.05,10 o Dioctyltin dilaurate, stannane, dioctyl-, bis(co Perfluorononan-1- oic acid (2,2,3,3,4,4,5,5,6,6,7 Perfluorohexane-1- sulphonic acid and its salts Dipentyl phthalate Cobalt-dichloride Alkanes, C10-13, chloro Bis(tributyltin) oxide Lead chromate Lead chromate molybdate sulfate red Tris(2-chloroethyl) phosphate bis(2-methoxyethyl) ether 1,2-Dimethoxyethane 1,2-bis(2- methoxyethoxy)ethane Decabromodiphenylether Diboron-trioxide Cadmium-oxide Lead(II,IV)-oxide Lead Cadmium Lead-dinitrate Lead-titanium-trioxide Pentalead-tetraoxide- sulphate Tetralead-trioxide- sulphate Dioxobis(stearato)trilead Lead titanium zirconium oxide Cyanamide, lead(2+) salt (1:1) Sulfurous Acid, Lead Salt, Dibasic