This document was generated on 08/31/2021 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 0444281604 Status: Active Overview: Micro-Fit Connector System Description: Micro-Fit BMI Header, Surface Mount Compatible, Dual Row, Right-Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, Tin (Sn) Plating Documents: Drawing (PDF) Test Summary 444280001-TS-000 (PDF) 3D Model Datasheet (PDF) 3D Model (PDF) Symbol Footprint Data SYM-44428-16046-001 (PDF) Product Specification PS-44300-001-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Packaging Specification PK-44428-001-001 (PDF) EU ELV Agency Certification Not Relevant CSA LR19980 EU RoHS China RoHS UL E29179 Compliant General REACH SVHC Product Family PCB Headers Contained Per - Series 44428 D(2021)4569-DC (8 Application Board-to-Board, Power, Wire-to-Board July 2021) Comments High Temperature Square Pin Solder Type Polarized to Benzo(ghi)perylene Mating Part Octanoic acid, Overview Micro-Fit Connector System 2,2,3,3,4,4,5,5,6,6,7,7,8,8,8- Product Name Micro-Fit BMI pen UPC 800756098067 Dodecamethylcyclohexasiloxane Decamethylcyclopentasiloxane Physical Octamethylcyclotetrasiloxane Breakaway No Disodium 3,3 - 1,1 - Circuits (Loaded) 16 Biphenyl -4,4 - Circuits (maximum) 16 Diylbis(Azo) Color - Resin Black 1,2- Durability (mating cycles max) 30 Benzenedicarboxylic First Mate / Last Break No acid, bis(3- Flammability 94V-0 methylbutyl) Glow-Wire Capable No 1,2-diethoxyethane Guide to Mating Part No Dibutyltin-dichloride Keying to Mating Part None C.I. Direct Black 38 Lock to Mating Part Yes Ammonium- Material - Metal Brass pentadecafluorooctanoate Material - Plating Mating Tin Phenol, 2-(2H- Material - Plating Termination Tin benzotriazol-2-yl)-4,6- Material - Resin High Temperature Thermoplastic bis(1,1-dim Net Weight 3.397/g 2-ethylhexyl 10- Number of Rows 2 ethyl-4,4-dioctyl-7- Orientation Right Angle oxo-8-oxa-3, PC Tail Length 3.50mm Dibutylbis(pentane-2,4- PCB Locator Yes dionato-O,O )tin PCB Retention None 2-(2H-Benzotriazol-2- PCB Thickness - Recommended 1.60mm yl)-4,6- Packaging Type Tray ditertpentylphenol Pitch - Mating Interface 3.00mm 2-(2H-Benzotriazol-2- Plating min - Mating 5.080m yl)-4-(tert-butyl)-6- Plating min - Termination 5.080m (sec-b Polarized to PCB Yes 1,2- Shrouded Fully Benzenedicarboxylic Stackable NoSurface Mount Compatible (SMC) Yes acid, dihexyl ester, Temperature Range - Operating -40 to +105C bra Termination Interface: Style Through Hole diisohexyl phthalate 1,2- Electrical Benzenedicarboxylic Current - Maximum per Contact 8.5A acid, dipentyl ester, br Voltage - Maximum 600V Zirconia Aluminosilicate Solder Process Data Refractory Ceramic Duration at Max. Process Temperature (seconds) 005 Fibr Lead-freeProcess Capability WAVE Nonadecafluorodecanoic Max. Cycles at Max. Process Temperature 001 acid (PFDA) and its Process Temperature max. C 260 sodiu Tris(4-nonylphenyl, Material Info branched and linear) Reference - Drawing Numbers phosphi Packaging Specification PK-44428-001-001 Perfluorobutane Product Specification PS-44300-001-001 sulfonic acid (PFBS) Sales Drawing SD-44428-001-001 and its sal Symbol/Footprint Data SYM-44428-1604 6-001 Fluoranthene Test Summary 444280001-TS-000 Pyrene Dodecachloropentacyclo 12.2.1.16,9.02,13.05,10 o Dioctyltin dilaurate, stannane, dioctyl-, bis(co Perfluorononan-1- oic acid (2,2,3,3,4,4,5,5,6,6,7 Perfluorohexane-1- sulphonic acid and its salts Dipentyl phthalate Cobalt-dichloride Alkanes, C10-13, chloro Bis(tributyltin) oxide Lead chromate Lead chromate molybdate sulfate red Tris(2-chloroethyl) phosphate bis(2-methoxyethyl) ether 1,2-Dimethoxyethane 1,2-bis(2- methoxyethoxy)ethane Decabromodiphenylether Diboron-trioxide Cadmium-oxide Lead(II,IV)-oxide Lead Cadmium Lead-dinitrate Lead-titanium-trioxide Pentalead-tetraoxide- sulphate Tetralead-trioxide- sulphate Dioxobis(stearato)trilead Lead titanium zirconium oxide Cyanamide, lead(2+) salt (1:1) Sulfurous Acid, Lead Salt, Dibasic