1801 Morgan Street Rockford, Illinois 61102 800-435-2931 www.molexkits.com Datasheet for 76650-0192 General Information Part Number: 76650-0192 Manufacturer: Molex / Waldom Title: Deluxe Board Stacking Application Kit Includes KK100, HDM, EBBI 50D, SEARAY, Plateau HS Mezz, IEEE1386, Description: SlimStack Product Families. Pitches range: 0.635mm (.025 - 2.54mm (0.1 Mezzanine IEEE 1386, HDM**, SlimStack, KK 100, EBBI 50D, Plateau HS Product Family: Mezz, and SEARAY* Certificates: (Molex Parts within this kit) - EU RoHS and RoHS by Exempt Compliant Country of Origin: Kit assembled in U.S.A. Specifications Design Configuration: Board-to-Board 0.635mm (.025 ), 1.0mm (.039 ), 1.20mm (.047 ), 1.27mm (.050 ), 1.27mm Pitch: (.050 ) sq. , 2mm (.079 ), and 2.54mm (.100 ) Connector Type: Receptacles and Headers/Plugs Circuit Sizes: 2, 3, 4, 6, 8, 12, 20, 50, 64, 72 and 200 Current Rating: 0.5, 1.0, 1.5, 2.5 and 4 Amps Voltage: 30, 100 and 240 Volts Product Highlights The SEARAY board-to-board connector is designed for computer, networking, telecom, storage and general market applications with high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards (PCBs). The design of our SEARAY has superior electrical and mechanical features that are cost competitive. The unique, Molex-patented, solder charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated stack heights cover 7mm (.276 ) to 13mm (.512 ). Molex s SlimStack connectors are tested to accommodate frequency rates up to 3 GHz for various high-speed applications. With a broad range of circuit sizes and stack heights, SlimStack offers an economical way to achieve high-speed performance in both 50 and 100 Ohm systems. Utilizes proprietary Plateau Technology (plated gold housing) to provide a high- speed high-density mezzanine connector system for differential and single-ended signal applications. The gold-plated plastic shields each differential pair from neigh- boring pairs, lowering crosstalk and improving signal clarity. Different stack heights and circuit sizes provide flexibility in design and grounding the conductive housing eliminates the need for individual ground pin designations within the connector. * SEARAY is a trademark of Samtec, Inc. ** HDM is a registered trademark of Amphenol Corporation For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com Page 1 of 61801 Morgan Street Rockford, Illinois 61102 800-435-2931 www.molexkits.com Datasheet for 76650-0192 Product Highlights continued The High Density Metric (HDM) connector system is designed for applications that require high interconnect density and high-speed signal integrity. Signal modules of 72 and 144 contacts are available. Daughtercard modules are combined on a metal stiffener so that they are handled as one connector. Special modules are available for power, guidance, mounting and coding functions. These building blocks can be combined to create very large connectors. Connectors of above 1000 circuits are not unusual. The power contacts can handle 15A of current per power blade, efficiently delivering hundreds of watts in multiple voltage levels, even in hot plug applications. The IEEE 1386 standard contains the details for adding standardized PCI mezzanine cards (PMC) to VMEbus and Multibus host boards. There are also many LAN, WAN, telecommunications, PC and workstation users who want a standardized mezzanine scheme and see the IEEE 1386 as the best approach. The fully shrouded leaf-style design minimizes the chance of damaging plug contacts. Our receptacle contacts feature a low mating force that reduces PCB stress. Gold over Nickel contact plating enhances long-term reliability, while the UL94V-0 LCP housings withstand SMT reflow processes. Excellent tolerance absorption allows the connector to be used in combinations of one to four mated pairs for up to 256 circuits. The connector design is hard-metric, easy-mating, robust, surface-mounted and features high circuit density, with excellent electrical performance. Along with that, it comes in a range of stacking heights from 8.00 through 15.00mm (.315 through .591 ) for optimizing system function. The proven KK system ofbuilding bloc connectors can be used to create thousands of different configurations. The Molex KK interconnection system can provide all the options necessary to complement PC board interconnection design requirements. For this reason, KK has become known as a versatile interconnecting system developed to meet the challenge of modularization. The Molex EBBI 50D series meets the market demand for low-cost, unshielded, high density, leaf-style connectors. Several configurations are available including vertical, right angle and blind-mating to provide valuable design flexibility and expandability. Leaf-style terminals are arranged in two rows on .050 spacing within a polarized- shaped housing for rugged mechanical protection. Housings are made of high temperature, UL 94V-0 thermoplastic. Terminals are plated with 30 micro-inches min. gold in the mating area for long term reliability and durability. ** HDM is a registered trademark of Amphenol Corporation Features and Benefits Applications Unique patented solder attach is more High and Mid-Range Computers and Servers cost effective and reliable than BGA Medical Scanning Equipment SEARAY footprint is compatible with other Military 1.27mm(.050 ) by 1.27mm(.050 ) products Network Routers and Switches Robust guidance and polarization aligns Mobile Base Stations connectors to mate in correct position For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com Page 2 of 6