This document was generated on 08/30/2021 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 0901512210 Status: Active Overview: C-Grid Connector Products Description: C-Grid III PC Board Connector, Dual Row, Vertical, 10 Circuits, Gold (Au) Plating Documents: 3D Model Application Specification 713080001-AS-000 (PDF) Drawing (PDF) Application Specification 901190001-AS-000 (PDF) 3D Model (PDF) Packaging Specification PK-90151-001-001 (PDF) Product Specification PS-99020-0001-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification UL E29179 EU ELV Not Relevant General Product Family PCB Receptacles EU RoHS China RoHS Series 90151 Compliant Application Board-to-Board, Signal REACH SVHC Overview C-Grid Connector Products Contained Per - Product Name C-Grid D(2021)4569-DC (8 UPC 800753670181 July 2021) Dipentyl phthalate Physical bis(2-(2- Circuits (Loaded) 10 methoxyethoxy)ethyl) Circuits (maximum) 10 ether Color - Resin Black Benzo(ghi)perylene Durability (mating cycles max) 100 Octanoic acid, Flammability 94HB 2,2,3,3,4,4,5,5,6,6,7,7,8,8,8- Glow-Wire Capable No pen Guide to Mating Part No Dodecamethylcyclohexasiloxane Keying to Mating Part None Decamethylcyclopentasiloxane Lock to Mating Part No Octamethylcyclotetrasiloxane Material - Metal Phosphor Bronze 1,2-diethoxyethane Material - Plating Mating Gold Dibutyltin-dichloride Material - Plating Termination Tin 1,3-Propanesultone Material - Resin Polyester C.I. Direct Black 38 Net Weight 0.845/g Ammonium- Number of Rows 2 pentadecafluorooctanoate Orientation Vertical 2,4-Di-tert-butyl-6-(5- PC Tail Length 2.90mm chlorobenzotriazol-2- PCB Locator No yl)p PCB Retention None Disodium-octaborate PCB Thickness - Recommended 1.60mm Dibutylbis(pentane-2,4- Packaging Type Tube dionato-O,O )tin Pitch - Mating Interface 2.54mm 2-(2H-Benzotriazol-2- Pitch - Termination Interface 2.54mm yl)-4,6- Plating min - Mating 0.381m ditertpentylphenol Plating min - Termination 3.048m Terphenyl, Polarized to PCB No hydrogenated Temperature Range - Operating -55 to +125C 1,2- Termination Interface: Style Through Hole Benzenedicarboxylic acid, dihexyl ester, Electrical bra Current - Maximum per Contact 3.0A diisohexyl phthalate Grounding to PCB No 1,2- Voltage - Maximum 350V Benzenedicarboxylic acid, dipentyl ester, br Solder Process DataLead-freeProcess Capability WAVE n-pentyl- isopentylphthalate Material Info Boric acid Aluminosilicate Reference - Drawing Numbers Refractory Ceramic Application Specification 713080001-AS-000, 901190001-AS-000 Fibres Packaging Specification PK-90151-001-001 Zirconia Product Specification PS-99020-0001-001 Aluminosilicate Sales Drawing SDA-90151-001 Refractory Ceramic Fibr Nonadecafluorodecanoic acid (PFDA) and its sodiu Tris(4-nonylphenyl, branched and linear) phosphi Perfluorobutane sulfonic acid (PFBS) and its sal Fluoranthene Pyrene Dioctyltin dilaurate, stannane, dioctyl-, bis(co Perfluorononan-1- oic acid (2,2,3,3,4,4,5,5,6,6,7 Methylhexahydrophthalic anhydride reaction mass of 2-ethylhexyl 10- ethyl-4,4-dioct Perfluorohexane-1- sulphonic acid and its salts Lead chromate Tris(2-chloroethyl) phosphate Boric acid, disodium salt, hydrate Strontium-chromate 1,2- Benzenedicarboxylic acid, di-C7-11- branched bis(2-methoxyethyl) ether 1,2- Benzenedicarboxylic acid, bis(2- methoxyethyl 1,2-Dimethoxyethane 1,2-bis(2- methoxyethoxy)ethane Decabromodiphenylether Cadmium-oxide Cadmium-sulphide Lead Cadmium pyrochlore, antimony lead yellow Lead-dinitrate Lead oxide sulfate (Pb2O(SO4)) Lead-titanium-trioxide