This document was generated on 02/20/2021 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 0956223882 EU ELV Status: Active Not Relevant Overview: Magnetic and Modular Jacks/Plugs Description: Modular Jack, Right-Angle, Through Hole, 8/8, Shielded, Reel EU RoHS China RoHS Compliant REACH SVHC Documents: Contained Per - 3D Model Packaging Specification PK-95122-002 (PDF) D(2020)4578-DC (25 Drawing (PDF) RoHS Certificate of Compliance (PDF) June 2020) 3D Model (PDF) Product Literature (PDF) henicosafluoroundecanoic Product Specification PS-95622-001-001 (PDF) acid disodium 4- Agency Certification amino-3- 4 - (2,4- UL E107635 diaminophenyl)azo chromium trioxide General 1,3-propanesultone Product Family Modular Jacks/Plugs 1-vinylimidazole Series 95622 4,4 -methylenedi-o- Comments Reflow Capable, External Shield toluidine Component Type PCB Jack dibutyltin dichloride Magnetic No methoxyacetic acid Overview Magnetic and Modular Jacks/Plugs 1,2- Performance Category 3 Benzenedicarboxylic Power over Ethernet (PoE) N/A acid, bis(3- Product Name Modular Jack 8/8, RJ45 methylbutyl) UPC 822350911719 disodium 3,3 - 1,1 - Physical biphenyl -4,4 - Boot Color N/A diylbis(azo) Color - Resin Black octamethylcyclotetrasiloxane Durability (mating cycles max) 2500 benzene-1,2,4- Flammability 94V-0 tricarboxylic acid 1,2- Inverted / Top Latch No anhydride Jack Height 13.00mm decamethylcyclopentasiloxane Keying to Mating Part None dodecamethylcyclohexasiloxane Lightpipes/LEDs None heptacosafluorotetradecanoic Material - Metal Copper Alloy acid Material - Plating Mating Gold over Palladium Nickel tricosafluorododecanoic Material - Plating Termination Tin acid Material - Resin High Temperature Thermoplastic Dipentyl phthalate Net Weight 37.340/g 6-methoxy-m-toluidine Orientation Right Angle (Side Entry) furan PCB Locator Yes 1-bromopropane PCB Retention Yes nitrobenzene PCB Thickness - Recommended 1.57mm 4-o-tolylazo-o- Packaging Type Embossed Tape on Reel toluidine Pitch - Mating Interface 1.02mm ethylene thiourea Pitch - Termination Interface 1.27mm 4-methyl-m- Plating min - Mating 0.051m, 0.600m phenylenediamine Plating min - Termination 1.905m o-toluidine Port Configuration 1x1 butyl 4- Positions / Loaded Contacts 8/8 hydroxybenzoate Surface Mount Compatible (SMC) No dinoseb (ISO) Temperature Range - Operating -40 to +85C dihexyl phthalate Termination Interface: Style Through Hole (DnHP) Waterproof / Dustproof No dicyclohexyl phthalate Wire/Cable Type N/A N-methylacetamide dimethyl sulphatediethyl sulphate Electrical 4-aminoazobenzene Current - Maximum per Contact 1.5A Fatty acids, C16-18, Grounding to PCB Yes lead salts Grounding to Panel Yes phthalato(2-) dioxotrilead Shielded Yes Silicic acid (H2Si2O5), Voltage - Maximum 125V DC barium salt (1:1), lead- Solder Process Data Perfluorohexane-1- Duration at Max. Process Temperature (seconds) 045 sulphonic acid and its Lead-freeProcess Capability WAVE salts Max. Cycles at Max. Process Temperature 001 5-sec-butyl-2-(2,4- Process Temperature max. C 260 dimethylcyclohex-3- en-1-yl)-5 Material Info 1,2- Reference - Drawing Numbers benzenedicarboxylic Packaging Specification PK-95122-002 acid, di-C6-10-alkyl Product Specification PS-95622-001-001 est Sales Drawing SD-95622-004 Cadmium sulphate Sodium perborate perboric acid, sodium salt hexahydro-2- benzofuran-1,3-dione 4-(1,1,3,3- tetramethylbutyl)phenol, ethoxylated Perfluorononan-1- oic acid (2,2,3,3,4,4,5,5,6,6,7 Reaction products of 1,3,4- thiadiazolidine-2,5-d Dodecachloropentacyclo 12.2.1.16,9.02,13.05,10 o Chrysene Cadmium nitrate Pyrene Tris(4-nonylphenyl, branched and linear) phosphi 2,3,3,3-tetrafluoro-2- (heptafluoropropoxy)propio 4-(1,1,3,3- tetramethylbutyl)phenol, ethoxylated Trixylyl phosphate Zirconia Aluminosilicate Refractory Ceramic Fibr Aluminosilicate Refractory Ceramic Fibres Boric acid Disodium tetraborate Hydrazine 1,3-BENZENEDIOL, TRINITRO-, LEAD SALT n-pentyl- isopentylphthalate 3-ethyl-2-methyl-2- (3-methylbutyl)-1,3- oxazolidi