+ UBSC/ULSC 60 GHz Ultra Broadband Silicon Capacitors Surface Mounted Rev 2.5 Key Features Key Applications + Ultra broadband performance up to 60 GHz Optoelectronics/high-speed data Resonance free Trans-Impedance Amplifiers (TIA) Phase stability Receive-and-Transmit Optical Sub-Assembly Ultra high stability of capacitance value over: (ROSA/TOSA) - Temperature < 0.5 % (-55C to +150C) Synchronous Optical Networking (SONET) - Voltage < 0.1 %/V High speed digital logic - Aging < 0.001 %/1000 hours Broadband test equipment Low ESL Broadband microwave/millimeter wave High reliability (FIT < 0.017 parts/billion hours) Replacement of X7R and NP0 Compatible with lead free reflow-soldering* Low profile applications (400 or 100 m) * Please refer to our Assembly Application Note for more details UBSC/ULSC Capacitors target optical The UBSC / ULSC capacitors provide very high communication systems (ROSA/TOSA, SONET reliability and capacitance stability over and all optoelectronics) as well as high speed temperature (0.5 %) and voltage. They have an data systems or products. The UBSC/ULSC are extended operating temperature range from -55 to designed for DC blocking, feedback, coupling and 150C. Reliable and repeatable performances bypass grounding applications. The unique are obtained thanks to a fully controlled technology of integrated passive devices in silicon production line with high temperature curing developed by IPDiA, offers low insertion loss, (above 900C) generating a highly pure oxide. low reflection and high phase stability from 16 The UBSC / ULSC series are compliant with kHz up to 60 GHz for the UBSC and up to 20 GHz standard JEDEC assembly rules, making the for the ULSC. These deep trench silicon product fully compatible with high speed capacitors have been developed with a automated pick-and-place manufacturing semiconductor MOS process. operations. Case sizes of 0201 and 0603 are also available. These capacitors are RoHS-compliant and are available with ENIG terminations. IPDiA Capacitors UBSC/ULSC Series Electrical Specifications Parameters Value Part number Product description Case Size Thickness (**) 10nF to 100 nF Capacitance range Surface Mount Ultra Broad Band Silicon Capacitor UBSC.xxx (**) + 15 % Capacitance tolerance from -55 to 150C, 60 GHz with ENIG termination Operating temperature range -55 C to 150 C 935 151 423 510 Ultra Broadband Si Cap 10nF 60+GHz 400m, BV>11V 0201 400m Storage temperature - 70 C to 165 C 935 151 723 510 Ultra Broadband Si Cap 10nF 60+GHz 400m, BV>30V 0201 400m Temperature coefficient <0.5 %, from -55 C to +150 C 935 152 423 510 Ultra Broadband Si Cap 10nF 60+GHz 100m, BV>11V 0201 100m (**) Breakdown voltage (BV) 11, 30 V 935 152 723 510 Ultra Broadband Si Cap 10nF 60+GHz 100m, BV>30V 0201 100m Capacitance variation 935 151 424 610 Ultra Broadband Si Cap 100nF 60+GHz 400m, BV>11V 0402 400m 0.1 %/V (from 0 V to RVDC) versus RVDC 935 152 424 610 Ultra Broadband Si Cap 100nF 60+GHz 100m, BV>11V 0402 100m Equivalent Serial Inductance (***) 935 151 425 610 Ultra Broadband Si Cap 100nF 60+GHz 400m, BV>11V 0603 400m Max 100 pH (ESL) 935 152 425 610 Ultra Broadband Si Cap 100nF 60+GHz 100m, BV>11V 0603 100m Equivalent Serial Resistance (***) Max 400 m (ESR) Surface Mount Ultra Broad Band Silicon Capacitor Insulation resistance 100 G min RVDC & +25C ULSC.xxx from -55 to 150C, 20 GHz with ENIG termination Aging Negligible, < 0.001 % / 1000h FIT<0.017 parts / billion hours Reliability 935 155 424 610 Ultra Broadband Si Cap 100nF 20 GHz 400m, BV>11V 0402 400m Capacitor height Max 400 m or 100 m 935 156 424 610 Ultra Broadband Si Cap 100nF 20 GHz 100m, BV>11V 0402 100m (**) Other values on request. (***) e.g. 100nF/0402/BV 11V 25C Fig.1: Capacitance variation vs temperature Fig.2: Capacitance variation vs DC biasing Fig.3: 100 nF/0402 UBSC measurement results voltage (for UBSC and MLCC technologies) (for UBSC and MLCC technologies) (S-parameters in transmission mode) UBSC/ULSC Capacitance Range Available parts see table above For other values, contact your IPDiA sales representative Termination and Outline Termination Package Outline Lead-free nickel/solder coating compatible For landing pad dimensions on your PCB layout, please refer with automatic soldering technologies: to IPDiA assembly application note. W reflow and manual. Pad dimensions Case size (typ. 0.01mm) ( mm ) L a b c L W T c a 0201 0.15 0.40 0.30 0.80 0.60 0.40 (standard 0402 0.30 0.50 0.40 1.20 0.70 profile) or 0.10 b T (low profile) 0603 0.40 0.90 0.80 1.80 1.10 Packaging Tape and reel, waffle pack, film frame carrier or raw wafer delivery. For more information, please visit: