DFE18SANR56ME0L Murata

Reference Only Spec No. JETE243A-0037G-01 P 1/8 CHIP COILCHIP INDUCTORSDFE18SANE0L REFERENCE SPECIFICATION 1. Scope This reference specification applies to DFE18SAN E0 series, Chip coil (Chip Inductors). 2.Part Numbering (ex) DF E 18 SA N 1R0 M E 0 L Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other Packaging (LW) and (T) Characteristics 3.Rating Operating Temperature Range (Ambient temperature Self-temperature rise is not included) -40 to +85C (Product temperature Self- temperature rise is included) -40 to +125C Storage Temperature Range. -40 to +85C Absolute maximum voltage 20V DC *3 Rated Current (Max.) (mA) Inductance DC Customer Murata Resistance 1 Based on 2 Based on Part Number Part Number () inductance Temperatur Tolerance (H) change e rise (%) DFE18SANR24ME0L 0.24 0.036 4200 3200 DFE18SANR47ME0L 0.47 0.064 3100 2400 20% DFE18SANR56ME0L 0.56 0.070 2600 2200 DFE18SAN1R0ME0L 1.0 0.144 2000 1600 1: The saturation allowable DC current value is specified when the decrease of the initial Inductance value at 30%. *2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to 40C max3:Keep the temperature (ambient temperature plus self-generation of heat) under 125 . 4. Testing Conditions (Standard atmospheric conditions) <Unless otherwise specified> <In case of doubt> Temperature : Ordinary Temperature (15 to 35C) Temperature : 20 2C Humidity : Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH) Atmospheric Pressure : 86 to 106 kPa 5.Appearance and Dimensions 1.60.2 no marking (in mm) Unit Mass (Typical value) 0.007g 0.80.2 0.30.2 MURATA MFG.CO., LTD 0.80.2 0.8maxReference Only Spec No. JETE243A-0037G-01 P 2/8 6. Electrical Performance No. No. Item Specification 6.1 Inductance Inductance shall meet item 3. Measuring Equipment: Agilent 4287A or equivalent (0.5V) Measuring Frequency: 1MHz 6.2 DC Resistance Measuring Equipment: Digital multi meter 6.3 Rated Current Self temperature rise shall be The rated current is applied. limited to 40C max. 7.Mechanical Performance No. Item Specification Test Method 7.1 Bonding Chip coil shall not be damaged. It shall be soldered on the substrate. Strength Applying Force(F) : 10N Hold Duration: 5s 7.2 Bending Substrate: Glass-epoxy substrate Strength (100401.0mm) Speed of Applying Force: 0.5mm / s Deflection: 2mm Hold Duration: 20s (in mm) 7.3 Vibration It shall be soldered on the substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 m Total amplitude : 1.5 mm or Acceleration amplitude 2 98m/s whichever is smaller. Testing Time: A period of 2h in each of 3 mutually perpendicular directions. (Total 6h) 7.4 Solderability The wetting area of the electrode shall Flux:Ethanol solution of rosin,25(wt)% be at least 90% covered with new Solder : Sn-3.0Ag-0.5Cu solder coating. Pre-Heating:15010C / 60 to 90s Solder Temperature:2455C Immersion Time:3 s 7.5 Resistance to Appearance:No damage Reflow soldering method Soldering Inductance Change : within 10% Flux: Ethanol solution of rosin,25(wt)% Heat Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150 to 180C / 60 to 120s Solder Temperature: 230C min. / 20 to 40s Peak Temperature: 250+5/-0C Reflow times: 2 times max Test board shall be 0.8 mm thick. Base material shall be glass epoxy resin. Then measured after exposure Standard atmospheric conditions for 1~2h. MURATA MFG.CO., LTD