GA342QR7GD681KW01L Murata

Safety Standard Certified Chip Multilayer Ceramic Capacitors for General Purpose GA342QR7GD681KW01 (1808, X7R:EIA, 680pF, AC250V) : packaging code Reference Sheet 1.Scope This specification is applied to safety standard certified Chip Multilayer Ceramic Capacitors Type GD used for UL60950 conformed devices. Standard No/*Certificate No UL:UL60950-1/E316111 *Above Certificate No. may be changed on account of the revision of standards and the renewal of certification. Do not use these products in any automotive power train or safety equipment including battery chargers for electric vehicles and plugin hybrids. 2.MURATA Part NO. System (Ex.) GA3 42 Q R7 GD 681 K W01 L (1)L/W (2)T (3)Temperature (6)Capacitance (7)Muratas Control (5)Nominal (4)Type Name (8)Packaging Code Dimensions Dimensions Characteristics Tolerance Code Capacitance 3. Type & Dimensions (Unit:mm) (1)-1 L (1)-2 W (2) T e g 4.50.3 2.00.2 1.5+0/-0.3 0.3 min. 2.5 min. Marking Type Name Code Company Name Abbreviation 4.Rated value (3) Temperature Characteristics Specifications and Test (6) (Public STD Code):X7R(EIA) Rated (5) Nominal Methods Capacitance Temp. coeff Temp. Range Voltage Capacitance (Operating Tolerance Temp. Range) orCap. Change (Ref.Temp.) -55 to 125 C -15 to 15 % AC 250 V 680 pF 10 % -55 to 125 C (25 C) (4) Type Name This denotes safety certified type name GD. Soldering Method Reflow 5.Package mark (8) Packaging Packaging Unit f180mm Reel L 2000 pcs./Reel EMBOSSED W12P4 f330mm Reel K 8000 pcs./Reel EMBOSSED W12P4 Product specifications in this catalog are as of Dec.9,2019,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and Cautions first. GA342QR7GD681KW01-01 1 Specifications and Test Methods Test Method Item Specification No (Ref. Standard:JIS C 5101, IEC60384 1 Appearance No defects or abnormalities. Visual inspection. 2 Dimension Within the specified dimensions. Using calipers and micrometers. 3 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations Test Voltage : AC1500V(r.m.s.) Applied Time : 60+/-1s Charge/discharge current : 50mA max. 4 Impulse voltage No self healing break downs or flash-overs have taken place 10 impulse of alternating polarity is subjected. (5 impulse for each polarity) in the capacitor. The interval between impulse is 60s. Applied Voltage: 2.5kV -p 0 5 Insulation Resistance(I.R.) 6000M or more Measurement Point : Between the terminations Measurement Voltage : DC500+/-50V Charging Time : 60+/-5s Measurement Temperature: Room Temperature 6 Capacitance Shown in Rated value. Measurement Temperature: Room Temperature Measurement Frequency :1.0+/-0.1kHz 7 Dissipation Factor (D.F.) 0.025 max. Measurement Voltage :AC1.0+/-0.2V(r.m.s.) 8 Temperature R7 : Within +/-15% (-55C to +125C) The capacitance change should be measured after 5 min. Characteristics at each specified temp. stage. of Capacitance Capacitance value as a reference is the value in step 3. Step Temperature( C) 1 Reference Temp.+/-2 2 Min.Operating Temp. +/-3 3 Reference Temp. +/-2 4 Max.Operating Temp. +/-3 5 Reference Temp. +/-2 Pretreatment Perform a heat treatment at 150+0/-10C for 1h+/-5min and then let sit for 24+/-2h at room condition*. 9 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate A shown inComplement of Test method. Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion 10Hz to 55Hz to 10Hz (1min) Total amplitude : 1.5mm D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). 10 Solderability 95% of the terminations is to be soldered evenly and Test Method : Solder bath method continuously. Flux: Solution of rosin ethanol 25(wt)% Preheat : 80 to 120 for 10s to 30s Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder) Solder Temp. : 245+/-5 Immersion time : 2+/-0.5s Immersing in speed : 25+/-2.5mm/s. 11 Resistance Appearance No defects or abnormalities. Test Method : Solder bath method to Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder) Soldering Solder Temp. : 260+/-5 Heat Capacitance Within +/-10% Immersion time : 10+/-1s Change Immersing in speed : 25+/-2.5mm/s. Exposure Time : 24+/-2h at room condition*. I.R. 1000M or more Preheat : GA342/43 size :100 to 120 for 1 min and 170 to 200 for 1 min Pretreatment Voltage proof No defects. Perform a heat treatment at 150+0/-10C for 1h+/-5min and then let sit for 24+/-2h at room condition*. *Room Condition : Temperature:15 to 35C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa JEMCGS-03012B 2