High Q Chip Multilayer Ceramic Capacitors ( 100Vdc) for General Purpose GQM2195G2H200GB12 (0805, X8G, 20pF, DC500V) : packaging code Reference Sheet 1.Scope This product specification is applied to High Q Chip Multilayer Ceramic Capacitors (100Vdc) used for General Electronic equipment. 2.MURATA Part NO. System (Ex.) GQM 21 9 5G 2H 200 G B12 D (1)L/W (2)T (3)Temperature (4)Rated (5)Nominal (6)Capacitance (7)Muratas Control (8)Packaging Code Dimensions Dimensions Characteristics Voltage Capacitance Tolerance Code 3. Type & Dimensions (Unit:mm) (1)-1 L (1)-2 W (2) T e g 2.00.15 1.250.15 0.850.15 0.2 to 0.7 0.7 min. 4.Rated value (3) Temperature Characteristics Specifications and Test (4) (6) (Public STD Code):X8G (5) Nominal Methods Rated Capacitance (Operating Temp. coeff Temp. Range Capacitance Voltage Tolerance Temp. Range) orCap. Change (Ref.Temp.) 25 to 150 C 030 ppm/C DC 500 V 20 pF 2 % -55 to 150 C (25 C) 5.Package mark (8) Packaging Packaging Unit f180mm Reel D 4000 pcs./Reel PAPER W8P4 Product specifications in this catalog are as of Feb.25,2021,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and Cautions first. GQM2195G2H200GB12-01 1 Specifications and Test Methods Test Method No Item Specification (Ref. Standard:JIS C 5101, IEC60384 1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, P-P O-P V or V , whichever is larger, should be maintained within the rated voltage range. 2 Appearance No defects or abnormalities. Visual inspection. 3 Dimension Within the specified dimensions. Using Measuring instrument of dimension. 4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations Test Voltage : 250% of the rated voltage Applied Time : 1s to 5 s Charge/discharge current : 50mA max. 5 Insulation Resistance(I.R.) More than 10,000M Measurement Point : Between the terminations Measurement Voltage : DC Rated Voltage Charging Time : 1 min Charge/discharge current : 50mA max. Measurement Temperature : Room Temperature 6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature Capacitance Frequency Voltage 7 Q 30pF and over : Q 1400 C1000pF 1.0+/-0.1MHz 0.5 to 5.0Vrms 30pF and below : Q 800+20C C:Nominal Capacitance(pF) 8 Temperature Characteristics Nominal values of the temperature coefficient is shown in The capacitance change should be measured after 5 min of Capacitance Rated value. at each specified temp. stage. But,the Capacitance Change under 20/25 is shown in Table A. Capacitance value as a reference is the value in step 3. Capacitance Drift The capacitance drift is calculated by dividing the differences Within +/-0.2% or +/-0.05pF between the maximum and minimum measured values in the (Whichever is larger.) step 1,3 and 5 by the cap. value in step 3. Step Temperature(C) 1 Reference Temp.+/-2 2 Min. Operating Temp.+/-3 3 Reference Temp.+/-2 4 Max. Operating Temp.+/-3 5 Reference Temp.+/-2 9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3. of Termination should occur. Type Applied Force(N) GQM18 5 GQM21 10 Holding Time : 10+/-1s Applied Direction : In parallel with the test substrate and vertical with the capacitor side. 10 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion 10Hz to 55Hz to 10Hz (1min) Q Within the specified initial value. Total amplitude : 1.5mm This motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). 11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1. Bending test Capacitance Within +/-5% or +/-0.5pF Pressurization method : Shown in Fig.2 Change (Whichever is larger) Flexure : 1mm Holding Time : 5+/-1s Soldering Method : Reflow soldering 12 Solderability Test Method : Solder bath method 95% of the terminations is to be soldered evenly and continuously. Flux Solution of rosin ethanol 25(mass)% Preheat : 80 to 120 for 10s to 30s Solder : Sn-3.0Ag-0.5Cu Solder Temp. : 245+/-5 Immersion time : 2+/-0.5s JEMCNS-04836A 2