Chip Monolithic Ceramic Capacitor for General GRM21BR72H103KW09 (0805, X7R:EIA, 10000pF, DC500V) : packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.Do not use these products in any automotive power train or safety equipment including battery chargers for electric vehicles and plugin hybrids. 2.MURATA Part NO. System (Ex.) GRM 21 B R7 2H 103 K W09 L (1)L/W (2)T (3)Temperature (4)Rated (5)Nominal (6)Capacitance (7)Muratas Control (8)Packaging Code Dimensions Dimensions Characteristics Voltage Capacitance Tolerance Code 3. Type & Dimensions (Unit:mm) (1)-1 L (1)-2 W (2) T e g 2.00.2 1.250.2 1.250.2 0.3 min. 0.7 min. 4.Rated value (3) Temperature Characteristics Specifications and Test (4) (6) (Public STD Code):X7R(EIA) (5) Nominal Methods Rated Capacitance Capacitance (Operating Temp. coeff Temp. Range Voltage Tolerance Temp. Range) orCap. Change (Ref.Temp.) -55 to 125 C -15 to 15 % DC 500 V 10000 pF 10 % -55 to 125 C (25 C) Soldering Method Flow / Reflow 5.Package mark (8) Packaging Packaging Unit f180mm Reel L 3000 pcs./Reel EMBOSSED W8P4 f330mm Reel K 10000 pcs./Reel EMBOSSED W8P4 Product specifications in this catalog are as of Sep.13,2016,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and Cautions first. GRM21BR72H103KW09-01 1 Specifications and Test Methods Test Method Item Specification No (Ref. Standard:JIS C 5101, IEC60384 1 Appearance No defects or abnormalities. Visual inspection. 2 Dimension Within the specified dimensions. Using calipers and micrometers. 3 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations Test Voltage : DC750V(150% of the rated voltage) Applied Time : 1 to 5 s Charge/discharge current : 50mA max. 4 Insulation Resistance(I.R.) C 0.01F : 100 M F or more Measurement Point : Between the terminations C < 0.01F : 10000 M or more Measurement Voltage : DC500+/-50V Charging Time : 60+/-5s Measurement Temperature: Room Temperature 5 Capacitance Shown in Rated value. Measurement Temperature: Room Temperature Measurement Frequency : 1.0+/-0.1kHz 6 Dissipation Factor (D.F.) 0.025 max. Measurement Voltage : AC1.0+/-0.2V(r.m.s.) 7 Temperature R7 : Within +/-15% (-55C to +125C) The capacitance change should be measured after 5 min. Characteristics at each specified temp. stage. of Capacitance Capacitance value as a reference is the value in step 3. Step Temperature( C) 1 Reference Temp.+/-2 2 Min.Operating Temp. +/-3 Step 1 2 3 4 5 3 Reference Temp. +/-2 Temp.( C) 252 -553 252 1252 252 4 Max.Operating Temp. +/-3 5 Reference Temp. +/-2 Pretreatment Perform a heat treatment at 150+0/-10C for 1h+/-5min and then let sit for 24+/-2h at room condition*. 8 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate A shown inComplement of Test method. Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion 10Hz to 55Hz to 10Hz (1min) Total amplitude : 1.5mm D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). 9 Solderability Test Method : Solder bath method 95% of the terminations is to be soldered evenly and continuously. Flux: Solution of rosin ethanol 25(wt)% Preheat : 80 to 120 for 10s to 30s Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder) Solder Temp. : 245+/-5 Immersion time : 2+/-0.5s Immersing in speed : 25+/-2.5mm/s. 10 Resistance Appearance No defects or abnormalities. Test Method : Solder bath method to Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder) Soldering Capacitance Within +/-10% Solder Temp. : 260+/-5 Heat Change Immersion time : 10+/-1s Immersing in speed : 25+/-2.5mm/s. D.F. Within the specified initial value. Exposure Time : 24+/-2h at room condition*. Preheat : GRM31 size max.: 120 to 150 for 1 min GRM32 size min. : 100 to 120 for 1 min I.R. Within the specified initial value. and 170 to 200 for 1 min Pretreatment Voltage proof No defects. Perform a heat treatment at 150+0/-10C for 1h+/-5min and then let sit for 24+/-2h at room condition*. *Room Condition : Temperature:15 to 35C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa JEMCGS-03070A 2 Step Temp. (C) Time (min) 1 -553 303 2 Room Temp. 2 to 3 3 1252 303 4 Room Temp. 2 to 3 Chip Capacitor Chip Capacitor Land Land a Solder Resist b a Solder Resist b c c