SURFACE MOUNT
MONOLITHIC CHIP
CAPACITORS
SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
COG AND TEMPERATURE COMPENSATING TYPES
GRM36/39/40/42-6/42-2/43-2/44-1 Series
FEATURES
Miniature size
No Polarity
Nickel Barrier Termination Standard highly resistant to
metal migration
Uniform dimensions and configuration
Suitable for reflow soldering
GRM39, 40 and 42-6 suitable for wave soldering
Minimum series inductance
Tape and Reel Packaging
Bulk Case Packaging available for GRM40 and smaller
Wide selection of capacitance values and voltages
Largest production capacity and volume in the world
PART NUMBERING SYSTEM
GRM40 COG 101 J 050 A D
CAPACITOR 3-digit code TEMPERATURE CAPACITANCE VALUE CAPACITANCE VOLTAGE MARKING PACKAGING
TYPE AND SIZE appears as CHARACTERISTICS Expressed in picofarads TOLERANCE Identified A = Unmarked
See below and necessary COG and identified by a *= Standard by a
following pages. to indicate COH three-digit number. 5pf: three-digit
Reel Diameter/
special P2H First two digits B = .1pf number.
Code
Tape Material
thickness R2H represent significant *C = .25pf
requirements. S2H figures. Last digit >5pf to 10pf: 7 Paper Tape D
Please consult T2H specifies the number B = .1pf
7 Plastic Tape L
your local U2J of zeros to follow. C = .25pf
13 Paper Tape J
sales office SL For fractional values *D = .5pf
for details. below 10pF, the letter R >10pf: 13 Plastic Tape K
is used as the decimal K = 10%
Bulk B
point and the last digit *J = 5%
Bulk Cassette C
becomes significant. G = 2%
7 Paper
F= 1%
Q
2mm pitch
See pages 115 -118 for labeling and
packaging information.
CHIP DIMENSIONS
EIA L W T e (min.) g (min.)
Dimensions: mm Size
Code Length Width Thickness Termination Insulation
GRM36 0402 1.0 0.05 0.5 0.05 0.5 0.05 0.15 ~ 0.3 0.4
GRM39* 0603 1.6 0.1 0.8 0.1 0.8 0.1 0.2 ~ 0.5 0.5
0.6 0.1
g
ee
GRM40 0805 2.0 0.1 1.25 0.1 0.85 0.1 0.2 ~ 0.7 0.7
1.25 0.1
0.85 0.1
3.2 0.15 1.6 0.15
GRM42-6 1206 1.15 0.1 0.3 ~ 0.8 1.5
3.2 0.2 1.6 0.2 1.6 0.2
T
1.15 0.1
1.35 0.15
LW
GRM42-2 1210 3.2 0.3 2.5 0.2 0.3 min. 1.0
1.8 0.2
2.5 0.2
GRM43-2 1812 4.5 0.4 3.2 0.3 2.0 max. 0.3 min. 2.0
GRM44-1 2220 5.7 0.4 5.0 0.4 2.0 max. 0.3 min. 2.0
*Bulk case packaging is L = 1.6 0.07, W, T = 0.8 0.07.
CHIP TERMINATION DIAGRAMS
Nickel Barrier Layer (Standard)
GRM Series
Ceramic Dielectric
Inner Electrode
Inner Termination (Ag or Ag/Pd or Cu)
Nickel Plated Barrier Layer
Tin Plating*
*Size 0402 Solder Plated
All products on this page are available as standard through authorized Murata Electronics Distributors.
CG01-J 7SURFACE MOUNT MONOLITHIC CHIP CAPACITORS
COG AND TEMPERATURE COMPENSATING TYPES
GRM36/39/40/42-6/42-2/43-2/44-1 Series
SPECIFICATION
GENERAL ELECTRICAL
TEST
Temperature Coefficient Temperature Range
Capacitance & Q 1000pF 1MHz 100Hz @ 1.0 .2 Vrms
C0G = 0 30 ppm* 55 to +125C
(Frequency & Voltage): >1000pF 1kHz 100Hz @ 1.0 .2 Vrms
C0H = 0 60 ppm 55 to +125C
30pF: 400 + (20xC (pF))
P2H = N150 60 ppm 55 to +85C
Q Limits
>30pF: 1000 minimum
R2H = N220 60 ppm 55 to +85C
S2H = N330 60 ppm 55 to +85C
100,000 megohms or 1000 megohms mfd
Insulation Resistance
(whichever is less) with rated voltage applied
T2H = N470 60 ppm 55 to +85C
(I.R.)
for 2 minutes max with 50mA limiting current
U2J = N750 120 ppm 55 to +85C
SL = N1000 to P350 55 to +85C
250% of rated voltage for 5 seconds with series
Dielectric Strength
resistor limiting charging current to 50mA max.;
(Flash)
200% for 500V
*TC Tolerance for COG
Refer to EIA-RS198E for other limitations
Aging Negligible
MECHANICAL
TEST TEST METHOD POST TEST LIMITS
0603 1.0 lbs.
Terminal
0805 2.2 lbs.
Adhesion
Glass Epoxy Board
No evidence of termination peeling
10
Mounting
2n
Load 1mm deflection (Glass epoxy board)
Capacitor
R340
Deflection
Deflection No mechanical damage
Cap., DF, IR meet initial limits
Unit: mm
45 45 Capacitance meter
Supporter
MIL-STD-202 Contact factory for
Solderability
Method 208F test limits
ENVIRONMENTAL
TEST TEST METHOD POST TEST LIMITS
MIL-STD-202, Method 107, Condition A Appearance: No visual damage
Thermal
C: = 2.0% or 0.5pF (whichever is greater)
Shock
Post thermal Shock measurement shall be taken after 24 hours Q: >30pF = 1,000 min., 30pF = 400 + [20 x C(pF)]
(Air to Air)
stabilization. I.R.: = 100,000M min. or 1,000MF (whichever is less)
Appearance: No defects
Maintain the capacitor at 40 2C and 90 to 95% humidity for Capacitance: Within 5% or .0.5pF (whichever is greater)
Humidity, 500 12 hours. Remove and let sit for 24 2 hours at room Q/D.F.: 30pF and over: Q350; 10pf to 30pf: Q275+5/2C
Steady State temperature, then measure. Q/D.F.: 10pf and below: Q20010C
I.R.: 1,000M or 50M F (whichever is less)
C: Nominal Capacitance (pF)
Appearance: No defects
Apply the rated voltage at 40 2C and 90 to 95% humidity for Capacitance: Within 7.5% or .0.75pF (whichever is greater)
Humidity Load 500 12 hours. Remove and let sit for 24 2 hours at room Q/D.F.: 30pF and over: Q200;
temperature, then measure. The charge/discharge current is Q/D.F.: 30pf and below: Q10010/3C
.
less than 50mA. I.R.: 500M or 25M F (whichever is less)
C: Nominal Capacitance (pF)
Apply 200% of rated voltage for 1000 12 hours at Appearance: No defects
maximum operating temperature; 150% for 500V. Capacitance: 3% or .3pF (whichever is greater)
Life Test Q: >30pF = 500 min., 30pF = 200 + [10 x C(pF)]
Upon completion of above test wait 24 hours prior I.R.: 1,000M or 50M F (whichever is less)
to performing post testing. Flash: 250% rated voltage
STORAGE LIFE
Chip component terminations should 1. All chip components, including 3. The solderability of the chip
tape and reel, should be kept in components should be rechecked
generally be protected from moisture.
an area where the temperature in the event that they are not used
In addition, they should also be
is between 5C and 40C and in six months.
protected from materials containing
where the humidity is 20% to 70%.
chlorine, sulfur compounds or any
4. Peel strength and shelf life of tape
harmful gases that could cause
2. The chip components should be are guaranteed for 1 year when
degradation of the solder. used within six months. stored under afore said conditions.
8 CG01-J