LQB15NNR56K10D Murata

Spec.No.JELF243B-0045C-01 P1/8 CHIP COIL (CHIP INDUCTORS) LQB15NN10D REFERENCESPECIFICATION 1. Scope This reference specification applies to LQB15NN 10 series, Chip coil (Chip Inductors). 2. Part Numbering (ex.) LQ B 15 N N R56 J 1 0 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (1)Product ID (2)Type (3)Dimension(L) (4)Category (5)Applications and Characteristics (6)Inductance (7)Tolerance (8)Features (9)Electrode (10)Packaging (D:Taping / *B:Bulk) *Bulk packing also available. 3.Rating Operating temperature-55C to +125C Storage temperature-55C to +125C Self Inductance DC Rating Customer MURATA Q Resonant Resustance Current Part Number Part Number (min.) Frequency (nH) Tolerance ( max.) (mA) (MHz min.) LQB15NNR22J10D J5% LQB15NNR22K10D 220 K10% 0.35 25% 380 LQB15NNR22M10D M20% LQB15NNR27J10D J5% LQB15NNR27K10D 270 K10% 0.41 25% 330 LQB15NNR27M10D M20% LQB15NNR33J10D J5% LQB15NNR33K10D 330 K10% 0.48 25% 300 M20% LQB15NNR33M10D 10 80 LQB15NNR39J10D J5% LQB15NNR39K10D 390 K10% 0.54 25% 300 M20% LQB15NNR39M10D LQB15NNR47J10D J5% K10% LQB15NNR47K10D 470 0.64 25% 300 LQB15NNR47M10D M20% LQB15NNR56J10D J5% LQB15NNR56K10D 560 K10% 0.73 25% 300 LQB15NNR56M10D M20% 4. Testing Conditions Unless otherwise specified In case of doubt Temperature : Ordinary Temp. (15 C to 35 C ) Temperature : 20C2 C Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 5.Appearance and Dimensions 1.00.05 0.50.05 No marking. 0.250.1 Unit Mass(Typical value) :Electrode 0.001g (in mm) MURATA MFG.CO.,LTD. 0.50.05 Spec.No.JELF243B-0045C-01 P2/8 6.Specifications 6-1.Electrical Performance No. Item Specification Test Method 6-1-1 Inductance Meet item 3. Measuring Frequency : 25MHz 6-1-2 Q Measuring Equipment : Agilent 4291A or the equivalent Test Fixture : Agilent 16192A or the equivalent 6-1-3 SRF 6-1-4 DC Meet item 3. Measuring Equipment : Digital multi meter Resistance 6-1-5 Rated Self temperature rise shall be The rated current is applied. Current limited to 25C max. 6-2.Mechanical Performance No. Item Specification Test Method 6-2-1 Appearance Meet item 5. Visual Inspection and measured with Slide Calipers. And Dimensions 6-2-2 Bonding Chip coil shall not be damaged It shall be soldered on the substrate. Strength Applying Force(F) : 5N after test as test method. Applying Time : 5s1s Applying Direction: Parallel to the substrate. Side view R0.5 Substrate 6-2-3 Bending Appearance: No damage It shall be soldered on the substrate. Strength Substrate: Glass-epoxy 100mm40mm 0.8mm Deflection : 2.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s Pressure jig R340 F Deflection 45mm 45mm Product 6-2-4 Vibration It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) 6-2-5 Resistance Pre-Heating : 150C10C, 60s90s to Soldering Solder : Sn-3.0Ag-0.5Cu Heat Solder Temperature : 270C5C Immersion Time : 10s0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room conditionfor 48h4h. MURATA MFG.CO.,LTD.