Reference Only SpecNo.JELF243A-0040T-01 P1/8 CHIP COILCHIP INDUCTORSLQH32CN33L REFERENCESPECIFICATION 1.Scope This reference specification applies to LQH32CN 33 Series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ H 32 C N R15 M 3 3 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (LW) and L:Taping Characteristics 3.Rating Operating Temperature Range. -40 to +85C Storage Temperature Range. -40 to +85C Self Inductance DC Rated Customer MURATA Resonant Resistance Current Part Number Part Number Frequency (H) Tolerance(%) () (mA) (MHz min) LQH32CNR15M33L 0.15 0.028 30% 400 1450 LQH32CNR27M33L 0.27 0.034 30% 250 1250 LQH32CNR47M33L 0.47 0.042 30% 150 1100 20% LQH32CN1R0M33L 1.0 0.060 30% 100 1000 LQH32CN2R2M33L 2.2 0.097 30% 64 790 LQH32CN4R7M33L 4.7 0.15 30% 43 650 LQH32CN100K33L 10 10% 0.30 30% 26 450 When applied Rated current to the Products , self temperature rise shall be limited to 20 max and Inductance will be within 10% of initial Inductance value. 4. Testing Conditions Unless otherwise specified In case of doubt Temperature : Ordinary Temperature (15 to 35C) Temperature : 20 2C Humidity : Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70%(RH) Atmospheric Pressure : 86 to 106 kPa 5.Appearance and Dimensions Fig.1 2.50.2 2.50.2 2.50.2 A 2.50.2 2.50.2 3.20.3 A: 2.8 max. Please refer to the dimention A for * 2R2M,4R7M,100K types. (See Fig.1) * No marking. Unit Mass (Typical value) 0.060 0.90.3 0.90.3 (in mm) 1.30.2 MURATA MFG.CO., LTD 2.00.2Reference Only SpecNo.JELF243A-0040T-01 P2/8 6.Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment:KEYSIGHT 4192A or equivalent Measuring Frequency:1MHz 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter 6.3 Self Resonant S.R.F shall meet item 3. Measuring Equipment: Frequency(S.R.F) KEYSIGHT E4991A or equivalent 7.Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged. Substrate: Glass-epoxy substrate Applied Direction : Chip coil Substrate Force: 10N Hold Duration: 51s 7.2 Bending Test Substrate: Glass-epoxy substrate (100401.6mm) Speed of Applying Force: 1mm / s Deflection: 2mm Hold Duration: 30s Pressure jig R340 F Deflection 45 45 Product (in mm) 7.3 Vibration Oscillation Frequency: 10~55~10Hz for 1 minute Total Amplitude: 1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) 7.4 Solderability The wetting area of the electrode Flux: Ethanol solution of rosin, 25(wt)% shall be at least 90% covered with (Immersed for 5s to 10s) new solder coating. Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 15010C / 60 to 90seconds Solder Temperature: 2405C Immersion Time: 31 s 7.5 Resistance to Appearance:No damage Flux: Ethanol solution of rosin, 25(wt)% Soldering Heat Inductance Change: within 5% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 15010C / 60 to 90seconds Solder Temperature: 2705C Immersion Time: 101 s Then measured after exposure in the room condition for 242 hours. MURATA MFG.CO., LTD