MYTNC1R86RELA2RA Murata

MYTNC1R86RELA2RA Document Category: Datasheet Ultra BK 6A DC DC Converter Module Product Description The MYTNC1R86RELA2RA is miniature UltraBK called Ultra Block, an ultra-thin high efficiency integrated power solution that combines a 6A DC/DC converter with components. This totally integrated module provides up to 90.0% efficiency in a small and thin 10.5 x 9.0 x 2.1mm LGA package. Muratas easy-to-use module terminal design allows simple power layout and maximum efficiency by minimizing routing parasitic resistance. Efficiency Wide input voltage 6.0 to 14.4V Ta=25C 12VIN 1.8VOUT Settable output voltage 0.7 to 1.8V Efficiency up to 90.0% Up to 87.5% Efficiency with 12VIN/1.8VOUT/6A Up to 6A Ultra-thin/small 10.5 x 9.0 x 2.1mm LGA package Suitable to be place on the back side of PCB Features Power-good output Over-current and Over-temperature protection Remote on/off control Output voltage sense 2 I C 6.0-compatible serial interface operating up to 1MHz. Figure 1. Efficiency Plot Typical Applications PCIe / server applications Simplified Application Circuit FPGA and DSP Datacom / telecom systems Distributed bus architectures (DBA) Programmable logic and mixed voltage systems Figure 2. Simplified Circuit Diagram MYTNC1R86RELA2RA Document Category: Datasheet Ultra BK 6A DC DC Converter Module Tape and Reel Specification................................................. 35 Product Description ............................................................. 1 Order Codes ...................................................................... 37 Features ............................................................................. 1 Notices ............................................................................. 37 Typical Applications ............................................................. 1 Efficiency ........................................................................... 1 CAUTION ................................................................... 37 Limitation of Applications .................................................................................... 37 Simplified Application Circuit ................................................ 1 Note ......................................................................................................... 37 (1) Absolute Maximum Ratings ................................................ 3 Product Specification .......................................................................................... 38 Sales contact ...................................................................................................... 38 (1) Recommended Operating Conditions .................................. 3 Disclaimers ....................................................................... 38 (1) (2) Package Thermal Characteristics ..................................... 3 Patent Statement ................................................................................................ 39 Electrical Characteristics ...................................................... 4 Copyright and Trademark .................................................... 39 Pin Configuration ................................................................. 8 Pin Descriptions .................................................................. 8 Functional Block Diagram ..................................................... 9 Typical Performance Characteristics .................................... 10 Thermal Deratings (Reference Data) ..................................... 11 Output Voltage Range ........................................................ 11 Limitation of Input Voltage Slew rate..................................... 12 Detailed Description ........................................................... 12 Output Voltage Remote Sense Function ............................................................ 12 Remote Enable Function .................................................................................... 12 Soft start Function ............................................................................................... 13 Power Good Operation ....................................................................................... 13 Telemetry System ............................................................................................... 13 2 I C Interface Bus Overview ................................................................................. 14 Standard-, Fast-, Fast-Mode Plus Protocol ........................................................ 14 2 I C Update Sequence ......................................................................................... 15 Register Map ....................................................................................................... 17 Detailed Register Description ............................................................................. 18 Protections ....................................................................... 24 Over Current Protection and Short Circuit Protection......................................... 24 Over Temperature Protection ............................................................................. 24 Soldering Guidelines .......................................................... 25 Pb-free Solder Processes .................................................... 25 Dry Pack Information .......................................................... 26 Application Performance ............................................. 27 Transient Performance ....................................................... 30 Test Circuit ....................................................................... 30 Component Selection ......................................................... 31 Input Fuse ........................................................................................................... 31 Input Capacitor .................................................................................................... 31 Output Capacitor ................................................................................................. 31 Packaging Information ........................................................ 32 Moisture Sensitivity Level ................................................................................... 32 Package Drawing ................................................................................................ 32 Recommended Board Land Pattern (Top View) ................................................. 32 Top Marking Specification ................................................................................... 33 Application Circuit ............................................................. 33 Application Circuit Part List (Recommended) ......................... 33 Application Board Example ................................................. 34