NFZ32SW901HN10L Murata

Reference Only SpecNo.JENF243J-0005A-01 P1/7 CHIP NOISE FILTER NFZ32SWHN10L REFERENCE SPECIFICATION 1.Scope This reference specification applies to NFZ32SW HN10L, Chip Noise Filter. 2.Part Numbering (ex) NF Z 32 SW 301 H N 1 0 L Product ID Structure Dimension Characteristics Typical Performance Category Numbers Other Packaging (L) Impedance of L:Taping at 100MHz Circuit 3.Rating Operating Temperature Range. (Ambient temperature Self-temperature rise is not included) -40 to +85C (Product temperature Self- temperature rise is included) -40 to +125C Storage Temperature Range. -40 to +125C Impedance Impedance DC Rated Current Customer MURATA at 100MHz, at 1MHz, Resistance Part Number Part Number (mA) ( ) Tolerance ( Typ.) () Tolerance NFZ32SW301HN10L 3.2 300 0.030 2550 30% 20% NFZ32SW901HN10L 6.8 900 0.045 2050 4. Testing Conditions Unless otherwise specified In case of doubt Temperature : Ordinary Temperature (15 to 35C) Temperature : 20 2C Humidity : Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH) Atmospheric Pressure : 86 to 106 kPa 5.Appearance and Dimensions 2.70.2 2.50.2 2.50.2 :2.8max. 3.20.3 Unit MassTypical value No marking. 0.044 (in mm) 0.90.31.30.2 0.90.3 6.Electrical Performance No. Item Specification Test Method Impedance Impedance shall meet item 3. 6.1 Measuring Equipment : Agilent 4192A or equivalent Measuring Frequency: 1MHz 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter MURATA MFG.CO., LTD 1.550.15Reference Only SpecNo.JENF243J-0005A-01 P2/7 7.Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip Noise Filter shall not be Substrate: Glass-epoxy substrate damaged. Force: 10N Chip Coil Hold Duration: 51s Substrate 7.2 Bending Test Substrate: Glass-epoxy substrate (100401.0mm) Speed of Applying Force: 0.5mm / s Deflection: 3mm Hold Duration: 5seconds. Pressure jig R230 F Deflection 45 45 Product (in mm) Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes 7.3 Vibration Total amplitude : 1.5 mm or Acceleration amplitude 2 98 m/s whichever is smaller. Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) 7.4 Solderability The wetting area of the electrode Flux: Ethanol solution of rosin,25(wt)% shall be at least 90% covered (Immersed for 5s to 10s) with new solder coating. Solder : Sn-3.0Ag-0.5Cu Pre-Heating: 15010C / 60 to 90seconds Solder Temperature: 2405C Immersion Time: 31 s 7.5 Resistance to Appearance: No damage Flux: Ethanol solution of rosin,25(wt)% Soldering Heat Impedance Change: within 30% (Immersed for 5s to 10s) Solder : Sn-3.0Ag-0.5Cu Pre-Heating: 15010C / 60 to 90seconds Solder Temperature: 2705C Immersion Time: 101 s Then measured after exposure in the room condition for 242 hours. MURATA MFG.CO., LTD