BAS321,135 Nexperia

BAS321 General purpose diode 18 June 2019 Product data sheet 1. General description General purpose diode fabricated in planar technology and encapsulated in a very small plastic SOD323 (SC76) package. 2. Features and benefits Small plastic SMD package Switching speed: max. 50 ns General application Continuous reverse voltage: max. 200 V Repetitive peak reverse voltage: max. 250 V Repetitive peak forward current: max. 625 mA AEC-Q101 qualified 3. Applications General purpose switching in surface mounted circuits 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I forward current 1 - - 250 mA F V reverse voltage - - 200 V R P total power dissipation T = 25 C 1 - - 300 mW tot amb V forward voltage I = 200 mA T = 25 C - - 1.25 V F F j 1 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 K Cathode 1 2 K A 001aaa020 2 A Anode SOD323Nexperia BAS321 General purpose diode 6. Ordering information Table 3. Ordering information Type number Package Name Description Version BAS321 SOD323 plastic surface-mounted package 2 leads SOD323 7. Marking Table 4. Marking codes Type number Marking code BAS321 A7 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V repetitive peak reverse - 250 V RRM voltage V reverse voltage - 200 V R I forward current 1 - 250 mA F I non-repetitive peak t = 10 ms T = 25 C square wave - 1.7 A FSM p j(init) forward current t = 1 s T = 25 C square wave - 9 A p j(init) t = 100 s T = 25 C square wave - 3 A p j(init) I repetitive peak forward t 0.5 ms 0.25 - 625 mA FRM p current P total power dissipation T = 25 C 1 - 300 mW tot amb T junction temperature - 150 C j T storage temperature -65 150 C stg 1 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance from 1 - - 366 K/W th(j-a) junction to ambient R thermal resistance from 2 - - 130 K/W th(j-sp) junction to solder point 1 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 2 Soldering point of cathode tab. BAS321 All information provided in this document is subject to legal disclaimers. Nexperia B.V. 2019. All rights reserved Product data sheet 18 June 2019 2 / 9