BAT46WJ Nexperia

BAT46WJ Single Schottky barrier diode Rev. 2 8 November 2011 Product data sheet 1. Product profile 1.1 General description Single planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a very small and flat lead SOD323F (SC-90) Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Low forward voltage Low capacitance Reverse voltage V 100 V AEC-Q101 qualified R Very small and flat lead SMD plastic package 1.3 Applications High-speed switching Voltage clamping Line termination Reverse polarity protection 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V reverse voltage - - 100 V R 1 V forward voltage I =250 mA --850 mV F F 1 I reverse current V =75V --4 A R R 1 Pulse test: t 300 s 0.02. p 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 1 cathode 1 2 12 2 anode sym001 1 The marking bar indicates the cathode. SOD323FBAT46WJ NXP Semiconductors Single Schottky barrier diode 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAT46WJ SC-90 plastic surface-mounted package 2 leads SOD323F 4. Marking Table 4. Marking codes Type number Marking code BAT46WJ JK 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 100 V R I forward current - 250 mA F 1 I non-repetitive peak square wave -2.5 A FSM forward current t <10ms p 2 4 P total power dissipation T 25 C -400 mW tot amb 3 4 -715 mW T junction temperature - 150 C j T ambient temperature 55 +150 C amb T storage temperature 65 +150 C stg 1 T =25 C before surge. j 2 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 2 3 Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm . 4 Reflow soldering is the only recommended soldering method. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit 1 3 R thermal resistance from in free air - - 310 K/W th(j-a) junction to ambient 2 3 - - 175 K/W BAT46WJ All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 8 November 2011 2 of 12