BAT86 Nexperia

BAT86 Schottky barrier single diode 25 July 2012 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a hermetically-sealed subminiature SOD68 (DO-34) package. The diode is suitable for mounting on a 2 E (5.08 mm) pitch. 1.2 Features and benefits Low forward voltage Guard ring protected Hermetically-sealed leaded glass package 1.3 Applications Ultra high-speed switching Voltage clamping Protection circuits Blocking diodes 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I average forward = 0.5 f = 20 kHz T 50 C PCB - - 200 mA F(AV) amb current mounting, lead length = 4 mm V reverse voltage - - 50 V R V forward voltage I = 10 mA T = 25 C - - 450 mV F F amb 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 K cathode 1 k a K A aaa-003679 2 A anode DO-34 (SOD68) 1 The marking band indicates the cathode. Scan or click this QR code to view the latest information for this productNXP Semiconductors BAT86 Schottky barrier single diode 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAT86 DO-34 hermetically sealed glass package axial leaded 2 leads SOD68 4. Marking Table 4. Marking codes Type number Marking code BAT86 marking band 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 50 V R I forward current - 200 mA F I average forward current = 0.5 f = 20 kHz T 50 C PCB - 200 mA F(AV) amb mounting, lead length = 4 mm I repetitive peak forward current t 1 s 0.5 - 500 mA FRM p I non-repetitive peak forward t 10 ms T = 25 C - 5 A FSM p j(init) current T junction temperature - 125 C j T ambient temperature -65 125 C amb T storage temperature -65 150 C stg 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance in free air 1 - - 320 K/W th(j-a) from junction to ambient 1 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. BAT86 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved Product data sheet 25 July 2012 2 / 8