IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection Rev. 2 12 October 2011 Product data sheet 1. Product profile 1.1 General description The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel RC low-pass filter arrays. They are designed to provide filtering of undesired RF signals in the 800 MHz-to-3000 MHz frequency band. They incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to 25 kV contact and higher than 25 kV air discharge, far exceeding IEC 61000-4-2, level 4. The devices support ESD protection of the USB data pins of a Universal Subscriber Identity Module (USIM) interface, as well as the digital standard SIM interface ESD protection and ElectroMagnetic Interface (EMI) filtering. The devices are fabricated using monolithic silicon technology. They integrate three resistors and eight high-level ESD protection diodes in a 0.4 mm pitch Quad Flat-pack No-leads (QFN) plastic package with a height of only 0.5 mm. These features make all three devices ideal for use in applications requiring component miniaturization, such as mobile phone handsets, cordless telephones and personal digital devices. Similar products are available in Wafer Level Chip-Size Package (WLCSP). IP4365CX11/P (0.4 mm pitch, 11-ball WLCSP11) is designed for USIM interfaces. IP4364CX8 (0.4 mm pitch, 8-ball WLCSP8) and IP4064CX8 (0.5 mm pitch, 8-ball WLCSP8) are designed for SIM interfaces. 1.2 Features and benefits Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) 3-channel SIM card interface integrated RC-filter array and SIM voltage ESD protection 2 USIM (USB 1.1) compliant ESD protection diodes with 20 pF channel capacitance Integrated 100 /100 /47 series channel resistors Total channel capacitance of 10 pF (IP4264CZ8-10-TTL), 20 pF (IP4264CZ8-20-TTL) or 40 pF (IP4264CZ8-40-TTL) Downstream ESD protection up to 25 kV (contact) according to IEC 61000-4-2 Micropak (QFN compatible) plastic package with 0.4 mm pitch 1.3 Applications SIM interfaces in for example, cellular phone and Personal Communication System (PCS) mobile handsetsIP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 2. Pinning information Table 1. Pinning Pin Description Simplified outline Graphic symbol 1 and 8 filter channel 1 8 5 R1 2 and 7 filter channel 2 1 8 100 3 and 6 filter channel 3 R2 4 and 5 ESD protection 2 7 1 4 47 Transparent GND ground R3 top view 3 6 100 4 5 018aaa015 3. Ordering information Table 2. Ordering information Type number Package Name Description Version IP4264CZ8-10-TTL HUSON8 plastic thermal enhanced extremely thin small outline package SOT1166-1 no leads 8 terminals body 1.35 1.7 0.55 mm IP4264CZ8-20-TTL IP4264CZ8-40-TTL 4. Marking Table 3. Marking codes Type number Marking code IP4264CZ8-10-TTL N1 IP4264CZ8-20-TTL N2 IP4264CZ8-40-TTL N4 IP4264CZ8-10 20 40-TTL All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 12 October 2011 2 of 15