X-On Electronics has gained recognition as a prominent supplier of PESD3V3C1BSF ESD Suppressors / TVS Diodes across the USA, India, Europe, Australia, and various other global locations. PESD3V3C1BSF ESD Suppressors / TVS Diodes are a product manufactured by Nexperia. We provide cost-effective solutions for ESD Suppressors / TVS Diodes, ensuring timely deliveries around the world.

PESD3V3C1BSF Nexperia

PESD3V3C1BSF electronic component of Nexperia
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Part No.PESD3V3C1BSF
Manufacturer: Nexperia
Category: ESD Suppressors / TVS Diodes
Description: DIODE, ESD PROTECTION, 3.3V, SOD-962
Datasheet: PESD3V3C1BSF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
5: USD 0.3929 ea
Line Total: USD 1.96 
Availability - 0
MOQ: 5  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 5
Multiples : 1
5 : USD 0.3929
10 : USD 0.2391
100 : USD 0.1264
500 : USD 0.0963
1000 : USD 0.0653
5000 : USD 0.061

   
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We are delighted to provide the PESD3V3C1BSF from our ESD Suppressors / TVS Diodes category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the PESD3V3C1BSF and other electronic components in the ESD Suppressors / TVS Diodes category and beyond.

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AN11046 Recommendations for PCB assembly of DSN0603-2 Rev. 3 30 September 2016 Application note Document information Info Content Keywords DSN0603, DSN0603-2, SOD962, 0603 package size, reflow soldering, surface mount, solder paste, stencil aperture, Printed-Circuit Board (PCB), Solder Mask Defined (SMD), footprint, landing pattern, pick and place, Chip-Scale Package (CSP) Abstract This application note provides guidelines for board assembly of the 2 ultra-small DSN0603-2 (0.6 0.3 mm ) chip-scale package. The main focus is on recommendations for reflow soldering. For general information about footprint design and reflow soldering, see application note AN10365 (Surface mount reflow soldering description). If not otherwise stated, all measurement units given in this document are metric units. This means that also the package nomenclature (for example the term0603 ) refers to metric units.AN11046 NXP Semiconductors Recommendations for PCB assembly of DSN0603-2 Revision history Rev Date Description 1 20120601 Initial version 2 20150923 Completely revised document 3 20160930 Section 1: added comment on tilting and occupied area Contact information For more information, please visit:

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
NEXPERIA USA INC
Nexperia USA Inc.
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