NEXCW224Z3.5V10.7X5.5TRF NIC

V-Chip Memory Back-Up Capacitors NEXCW Series FEATURES DOUBLE LAYER CONSTRUCTION RoHS Compliant POWER BACK-UP FOR CMOS DEVICES High Temperature Re ow SURFACE MOUNTABLE V-CHIP STYLE +260C LEAD-FREE FINISH CHARACTERISTICS Rated Voltage Range 3.5 & 5.5VDC SSuper Capacitoruper Capacitor Rated Capacitance Range 0.047F ~ 0.47F (47,000 F ~ 470,000 F) Application GuideApplication Guide Operating Temp. Range -40C ~ +85C Capacitance Tolerance +80%/-20% (Z) Capacitance Change Within 30% of initial measured value Load Life Test Maximum ESR Less than 200% of the speci ed maximum value +85C 240 hours Current at 30 minutes Less than 200% of the speci ed maximum value Capacitance Change Within +80%/-20% of speci ed value Temperature Cycling Maximum ESR Less than speci ed maximum value (5 cycles, -25 ~ +70C Current at 30 minutes Less than speci ed maximum value Capacitance Change Within 20% of initial measured value Humidity Resistance Maximum ESR Less than 120% of the speci ed maximum value (240 hours 40C/90% RH) Current at 30 minutes Less than 120% of the speci ed maximum value STANDARD VALUES AND SPECIFICATIONS Capacitance Working Max. Current Max. ESR NIC P/N Value (F) Voltage 30 minutes 1KHz Discharge (VDC) (mA) () NEXCW104Z3.5V10.7X5.5TRF 0.10 3.5 0.090 100 NEXCW224Z3.5V10.7X5.5TRF 0.22 3.5 0.200 50 NEXCW474Z3.5V10.7X8.5TRF 0.47 3.5 0.420 50 NEXCW473Z5.5V10.7X5.5TRF 0.047 5.5 0.071 100 NEXCW104Z5.5V10.7X5.5TRF 0.10 5.5 0.150 50 NEXCW224Z5.5V10.7X8.5TRF 0.22 5.5 0.330 50 HIGH TEMPERATURE REFLOW PROFILE Peak Temperature Peak Temperature +260C (260C) 250 Time above +255C 10 sec. max. 200 Time above Time above +230C 45 sec. max. 150 217C 70 sec. max. Time above +220C 60 sec. max. 100 Cool Down Time above 170C Time above +217C 70 sec. max. 50 sec. max. 50 150C ~ +200C Pre-heat 25 (with time above +170C 150 sec. max. 150C ~ 200C 150 sec. max. 50 sec. max.) 0 Time 1. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals. 2. 2x re ow process maximum. Capacitor should be allowed to return to room temperature before second re ow process. PRECAUTIONS WASHING is NOT RECOMMENDED. Additional precautions can be found at www.niccomp.com/precautions If in doubt or uncertainty, please review your speci c application - process details with NICs technical support personnel: tpmg niccomp.com NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 1 SPECIFICATIONS ARE SUBJECT TO CHANGE Temperature - Deg. CV-Chip Memory Back-Up Capacitors NEXCW Series CASE DIMENSIONS (mm) I + - I I D W Case Size L max. A/B 0.2 I P 10.7 x 5.5 10.7 5.5 10.8 3.9 0.5 1.2 0.1 5.0 w D 10.7 x 8.5 10.7 8.5 10.8 3.9 0.5 1.2 0.1 5.0 A 0.3mm max. L P B LAND PATTERN DIMENSIONS (mm) COMPONENT OUTLINE Case RS T Diameter T 10.7 5.0 4.9 2.5 S S R CARRIER TAPE DIMENSIONS (mm) Case Size A B D E F P P T T W Quantity/Reel 1 1 2 10.7 x 5.5 11.4 13.0 1.55 1.75 11.5 4.0 16.0 0.4 6.0 24.0 1,000 10.7 x 8.5 11.4 13.0 1.55 1.75 11.5 4.0 16.0 0.4 8.4 24.0 500 P 1.5 +0.1/- 1.75 T D 1 E - F W B + P A T Feeding 1 2 REEL DIMENSIONS (mm) Case Size A 2.0 B 1.0 C 0.5 D 0.8 E 0.5 W t 10.7 x 5.5 380 80.0 13.0 21.0 2.0 25.5 0.5 2.0 10.7 x 8.5 380 100.0 13.0 21.0 2.0 25.5 1.0 2.0 t CE B A W NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 2 SPECIFICATIONS ARE SUBJECT TO CHANGE