NSHC Series Stacked Film Capacitor Chips FEATURES STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM NSHC IS RECOMMENDED STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES O FOR NEW DESIGNS WIDE TEMPERATURE RANGE UP TO +125 C (100pF ~ 0.1 F) HIGH HEAT AND MOISTURE RESISTANT VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS RoHS CHARACTERISTICS Compliant SUITABLE FOR REFLOW SOLDERING includes all homogeneous materials TAPE AND REEL PACKAGING *See Part Number System for Details Case Sizes SPECIFICATIONS 0603 0805 1206 1210 1913 2416 Capacitance Range 100pF ~ 0.0027 F 100pF ~ .01 F 3300pF ~ .047 F .012 F ~ .1F .047 F ~ .1F .12 F ~ .22F Voltage Ratings 16Vdc (12Vrms), 50Vdc (40Vrms) Capacitance Tolerance 5% Std, 2% Opt. Temperature Range -55C ~ +125C (0.12 F ~ 0.22F voltage derated above +105C) Dissipation Factor (20C) 0.6% max. 1KHz Insulation Resistance (20C) 3 Gigohms Minimum 150% of Rated Voltage 60 Seconds or Dielectric Withstanding Voltage 175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes) Temperature Characteristic 3% C Maximum Over Temperature Range ENVIRONMENTAL CHARACTERISTICS Capacitance Change Within 2% of Initial Value Life Test At +125C 0.68% Maximum 1,000 Hours at 125% of Dissipation Factor Rated Voltage Insulation Resistance 1 Gigohm Minimum Within 3% of Initial Value Capacitance Change Resistance to Soldering Heat Dissipation Factor 0.66% Maximum +260C Peak 1 Gigohm Minimum Insulation Resistance Humidity Load Life: Capacitance Change (1) & (2) Within 2% of Initial value (3) Within 10% of initial value (1) 1000 Hours, +40C Dissipation Factor (1) & (2) 0.90% Maximum (3) 1.2% maximum (2) 500 Hours, +60C Insulation Resistance (1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min. (3) 500 Hours +85C/85% RH Solderability with 90% Minimum Coverage After 2.5 Second Dip into 255C Solder Pot 25% Wt Rosin-Methanol Flux RECOMMENDED REFLOW PROFILE (maximum 2 times) RECOMMENDED LAND 300 PATTERN (mm) Peak Temperature 260C 250 Case Code EIA Size A B C 200 J1 0603 0.6 2.0 0.7 A1, A2 0805 0.8 2.4 1.1 150 B1, B2, B3 1206 1.8 3.6 1.4 Cool Down 100 C2, C3 1210 1.8 3.6 2.3 Time above 230C D5, D6 1913 3.0 5.6 3.0 30 sec. max. 50 E6, E7, E8 2416 4.0 7.0 3.8 Pre-heat 25 Ramp-up 150C ~ 180C 25C ~ 150C 120 sec. max. 90 sec. max. 0 Time Solder within 1 year. Storage at +30C and 60% RH A B NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 1 SPECIFICATIONS ARE SUBJECT TO CHANGE Temperature - Deg. C CStacked Film Capacitor Chips NSHC Series 16V STANDARD PRODUCTS AND CASE SIZES Cap. Cap. Size Length Width Height Part Number p EIA Value Code Code L 0.2 W H 0.2 NSHC101J16TRJ1F 100pF 101 J1 NSHC121J16TRJ1F 120 121 J1 NSHC151J16TRJ1F 150 151 J1 NSHC181J16TRJ1F 180 181 J1 NSHC221J16TRJ1F 220 221 J1 NSHC271J16TRJ1F 270 271 J1 NSHC331J16TRJ1F 330 331 J1 NSHC391J16TRJ1F 390 391 J1 NSHC471J16TRJ1F 470 471 J1 1.6 0.8 0.15 0.7 0.15 0.35 0.20 0603 NSHC561J16TRJ1F 560 561 J1 NSHC681J16TRJ1F 680 681 J1 NSHC821J16TRJ1F 820 821 J1 NSHC102J16TRJ1F 0.001 102 J1 NSHC122J16TRJ1F 0.0012 122 J1 NSHC152J16TRJ1F 0.0015 152 J1 NSHC182J16TRJ1F 0.0018 182 J1 NSHC222J16TRJ1F 0.0022 222 J1 NSHC272J16TRJ1F 0.0027 272 J1 NSHC332J16TRA1F 0.0033 332 A1 NSHC392J16TRA1F 0.0039 392 A1 NSHC472J16TRA1F 0.0047 472 A1 0.9 NSHC562J16TRA1F 0.0056 562 A1 2.0 1.25 0.2 0.45 0.25 0805 NSHC682J16TRA1F 0.0068 682 A1 NSHC822J16TRA2F 0.0082 822 A2 1.1 NSHC103J16TRA2F 0.010 103 A2 NSHC123J16TRB1F 0.012 123 B1 NSHC153J16TRB1F 0.015 153 B1 0.9 NSHC183J16TRB1F 0.018 183 B1 NSHC223J16TRB1F 0.022 223 B1 3.2 1.6 0.2 0.65 0.35 1206 NSHC273J16TRB2F 0.027 273 B2 1.1 NSHC333J16TRB2F 0.033 333 B2 NSHC393J16TRB3F 0.039 393 B3 1.5 NSHC473J16TRB3F 0.047 473 B3 NSHC563J16TRC2F 0.056 563 C2 1.5 NSHC683J16TRC2F 0.068 683 C2 3.2 2.5 0.2 0.65 0.35 1210 NSHC823J16TRC3F 0.082 823 C3 2.1 NSHC104J16TRC3F 0.10 104 C3 OUTLINE DRAWING Stacked Element Terminations: 95.5% Sn, 4% Ag and 0.5% Cu over phenolic resin/Ag/Ni/Cu over copper base H L W 2 p p L 1