X-On Electronics has gained recognition as a prominent supplier of ISD4004-12MSY across the USA, India, Europe, Australia, and various other global locations. ISD4004-12MSY are a product manufactured by Nuvoton. We provide cost-effective solutions for ISD4004-12MSY, ensuring timely deliveries around the world.

ISD4004-12MSY Nuvoton

ISD4004-12MSY electronic component of Nuvoton
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See Product Specifications
Part No. ISD4004-12MSY
Manufacturer: Nuvoton
Category: Unclassified
Description: 720s Voice Record and Playback 28-Pin SOIC
Datasheet: ISD4004-12MSY Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
25: USD 19.7843 ea
Line Total: USD 494.61 
Availability - 0
MOQ: 25  Multiples: 25
Pack Size: 25
Availability Price Quantity
0
Ship by Wed. 05 Feb to Tue. 11 Feb
MOQ : 25
Multiples : 25
25 : USD 19.7843
50 : USD 18.629
100 : USD 17.7809

   
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We are delighted to provide the ISD4004-12MSY from our Nuvoton manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ISD4004-12MSY and other electronic components in the Nuvoton manufacturer and beyond.

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ISD4004 SERIES ISD4004 SERIES SINGLE-CHIP, MULTIPLE-MESSAGES VOICE RECORD/PLAYBACK DEVICES 8-, 10-, 12-, AND 16-MINUTE DURATION Publication Release Date: Oct 31, 2008 - 1 - Revision 1.31 ISD4004 SERIES 1. GENERAL DESCRIPTION ............................................................................................................... 3 2. FEATURES ....................................................................................................................................... 4 3. BLOCK DIAGRAM ............................................................................................................................ 5 4. PIN CONFIGURATION ..................................................................................................................... 6 5. PIN DESCRIPTION ........................................................................................................................... 7 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 12 6.1. Detailed Description ................................................................................................................ 12 6.2. Serial Peripheral Interface (SPI) Description .......................................................................... 13 6.2.1 OPCODES ....................................................................................................................... 14 6.2.2 SPI Diagrams ................................................................................................................... 15 6.2.3 SPI Control and Output Registers .................................................................................... 16 7. TIMING DIAGRAMS ....................................................................................................................... 18 8. ABSOLUTE MAXIMUM RATINGS.................................................................................................. 20 8.1. Operating Conditions............................................................................................................... 21 9. ELECTRICAL CHARACTERISTICS ............................................................................................... 22 9.1. Parameters For Packaged Parts ............................................................................................. 22 9.2. Parameters For Die ................................................................................................................. 25 9.3. SPI AC Parameters ................................................................................................................. 26 10. TYPICAL APPLICATION CIRCUIT ................................................................................................. 27 11. PACKAGING AND DIE INFORMATION ......................................................................................... 30 11.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC) ................................................................ 30 11.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) .......................................................... 31 11.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC ................. 32 11.4. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 ........................... 33 11.5. Die Information .................................................................................................................... 34 12. ORDERING INFORMATION .......................................................................................................... 36 13. VERSION HISTORY ....................................................................................................................... 37 Publication Release Date: Oct 31, 2008 - 2 - Revision 1.31

Nuvoton Technology
Nuvoton Technology Corporation of America
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