Product Information

74HCT04N

74HCT04N electronic component of NXP

Datasheet
IC, 74HCT CMOS, 74HCT04, DIP14, 5V

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.9129 ea
Line Total: USD 0.91

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 1
Multiples : 1
1 : USD 0.9129
10 : USD 0.6798
25 : USD 0.5373
50 : USD 0.4472
100 : USD 0.4022

     
Manufacturer
Product Category
Brand
Logic Family / Base Number
Supply Voltage Min
Supply Voltage Max
No. Of Pins
Logic Ic Family
Logic Ic Base Number
Operating Temperature Min
Operating Temperature Max
Svhc
Device Marking
Operating Temperature Range
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Termination Type
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74HC04; 74HCT04 Hex inverter Rev. 4 3 August 2012 Product data sheet 1. General description The 74HC04; 74HCT04 is a hex inverter. The inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of V . CC 2. Features and benefits Complies with JEDEC standard JESD7A Complies with JEDEC standard JESD8-1A Input levels: For 74HC04: CMOS level For 74HCT04: TTL level ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from 40 C to +85 C and from 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC04N 40 C to +125 C DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1 74HCT04N 74HC04D 40 C to +125 C SO14 plastic small outline package; 14 leads; body width SOT108-1 3.9 mm 74HCT04D 74HC04DB 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body SOT337-1 width 5.3 mm 74HCT04DB 74HC04PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads; SOT402-1 body width 4.4 mm 74HCT04PW 74HC04BQ 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1 thin quad flat package; no leads; 14 terminals; 74HCT04BQ body 2.5 3 0.85 mm74HC04; 74HCT04 NXP Semiconductors Hex inverter 4. Functional diagram 1 1 2 1A 1Y 2 1 1 3 4 3 2A 2Y 4 1 5 6 5 3A 3Y 6 1 9 8 4Y 9 4A 8 1 5A 5Y 10 11 11 10 13 6A 6Y 12 1 13 12 A Y mna342 mna343 mna341 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one inverter) 5. Pinning information terminal 1 index area 1Y 2 13 6A 1 14 2A 3 12 6Y 1A V CC 2 13 1Y 6A 2Y 4 04 11 5A 3 12 2A 6Y 3A 5 (1) 10 5Y GND 4 11 2Y 04 5A 6 9 3Y 4A 5 10 3A 5Y 6 3Y 9 4A 7 001aac442 GND 8 4Y 001aac441 Transparent top view (1) The die substrate is attached to the exposed die pad using conductive die attach material. It cannot be used as a supply pin or input. Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14 Fig 5. Pin configuration DHVQFN14 74HC_HCT04 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 4 3 August 2012 2 of 17 GND 7 1 1A 4Y 8 14 V CC

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