74LVC1G06GF,132 NXP

74LVC1G06 Inverter with open-drain output Rev. 10 29 June 2012 Product data sheet 1. General description The 74LVC1G06 provides the inverting buffer. Input can be driven from either 3.3 V or 5 V devices. These features allow the use of these devices in a mixed 3.3 V and 5 V environment. Schmitt-trigger action at all inputs makes the circuit tolerant for slower input rise and fall time. This device is fully specified for partial power-down applications using I . OFF The I circuitry disables the output, preventing the damaging backflow current through OFF the device when it is powered down. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. 2. Features and benefits Wide supply voltage range from 1.65 V to 5.5 V High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8B/JESD36 (2.7 V to 3.6 V) 24 mA output drive (V =3.0 V) CC CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Specified from 40 C to +125 C74LVC1G06 NXP Semiconductors Inverter with open-drain output 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G06GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package SOT353-1 5 leads body width 1.25 mm 74LVC1G06GV 40 C to +125 C SC-74A plastic surface-mounted package 5 leads SOT753 74LVC1G06GM 40 C to +125 C XSON6 plastic extremely thin small outline package SOT886 no leads 6 terminals body 1 1.45 0.5 mm 74LVC1G06GF 40 C to +125 C XSON6 plastic extremely thin small outline package SOT891 no leads 6 terminals body 1 1 0.5 mm 74LVC1G06GN 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1115 6 terminals body 0.9 1.0 0.35 mm 74LVC1G06GS 40 C to +125 C XSON6 extremely thin small outline package no leads SOT1202 6 terminals body 1.0 1.0 0.35 mm 74LVC1G06GX 40 C to +125 C X2SON5 X2SON5: plastic thermal enhanced extremely SOT1226 thin small outline package no leads 5 terminals body 0.8 0.8 0.35 mm 4. Marking Table 2. Marking codes 1 Type number Marking 74LVC1G06GW VR 74LVC1G06GV V06 74LVC1G06GM VR 74LVC1G06GF VR 74LVC1G06GN VR 74LVC1G06GS VR 74LVC1G06GX VR 1 The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram Y 2AY 4 A 2 4 A Y GND mna618 mna619 mna620 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram 74LVC1G06 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 10 29 June 2012 2 of 18