BGU7003,132 NXP

BGU7003 Wideband silicon germanium low-noise amplifier MMIC Rev. 02 22 June 2010 Product data sheet 1. Product profile 1.1 General description The BGU7003 MMIC is a wideband amplifier in SiGe:C technology for high speed, low-noise applications in a plastic, leadless 6 pin, extremely thin small outline SOT891 package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features Low noise high gain microwave MMIC Applicable between 40 MHz and 6 GHz Integrated temperature stabilized bias for easy design Bias current configurable with external resistor Noise figure NF = 0.80 dB at 1.575 GHz Insertion power gain = 18.3 dB at 1.575 GHz 110 GHz transit frequency - SiGe:C technology Power-down mode current consumption < 1 A Optimized performance at low 5 mA supply current ESD protection > 1 kV Human Body Model (HBM) on all pins 1.3 Applications GPS Satellite radio Low-noise amplifiers for microwave communications systems WLAN and CDMA applications Analog / digital cordless applicationsBGU7003 NXP Semiconductors Wideband silicon germanium low-noise amplifier MMIC 1.4 Quick reference data Table 1. Quick reference data T = 25 C V = 2.5 V I = 5.0 mA V 0.7 V f = 1575 MHz Z = Z = 50 (input and output matched to amb CC CC(tot) ENABLE S L 50 ) unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V supply voltage RF input AC coupled 2.2 - 2.85 V CC 1 I total supply current configurable with external resistor 3 - 15 mA CC(tot) T ambient temperature 40 +25 +85 C amb 2 P total power dissipation T 103 C - - 70 mW tot sp 2 s Insertion power gain - 18.3 - dB 21 NF noise figure - 0.80 - dB P input power at 1 dB gain compression - 20.1 - dBm i(1dB) IP3 input third-order intercept point jammers at f = f + 138 MHz and - 0.2 - dBm I 1 f = f + 276 MHz 2 1 I = I + I + I . CC(tot) CC RF OUT R BIAS 2 T is the temperature at the solder point of the ground lead. sp 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 R BIAS 1 2 3 5 6 2 RF IN 3 GND 2 4 4 RF OUT 13 5 ENABLE sym128 6 5 4 6 V CC bottom view 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGU7003 XSON6 plastic extremely thin small outline package no leads SOT891 6 terminals body 1 1 0.5 mm 4. Marking Table 4. Marking codes Type number Marking code BGU7003 B3 BGU7003 NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 22 June 2010 2 of 18