HITAG ISO 18000 transponder IC Rev. 3.0 18 March 2010 Product data sheet 184430 PUBLIC 1. General description The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various manufacturers well established for both the transponders/cards as well as the read/write devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs. With the new HITAG family, this existing infrastructure is extended with the next generation of ICs being substantially smaller in mechanical size, lower in cost, offering more operation distance and speed, but still being operated with the same reader infrastructure and transponder manufacturing equipment. The protocol and command structure for HITAG ISO 18000 is design to support Reader Talks First (RTF) operation, including anti-collision algorithm. 2. Features and benefits 2.1 Features Integrated circuit for contactless identification transponders and cards Integrated resonance capacitor of 210 pF with 3% tolerance or 280 pF with 5% tolerance over full production Frequency range 100 kHz to 150 kHz 2.2 Protocol Modulation read/write device transponder: 100 % ASK and binary pulse length coding Modulation transponder read/write device: Strong ASK modulation with anti-collision, Manchester coding Fast anti-collision protocol Data integrity check (CRC) Reader Talks First (RTF) Mode Data rate read/write device to transponder: 5.2 kbit/s Data rates transponder to read/write device: 4 kbit/sNXP Semiconductors HITAG ISO 18000 transponder IC 2.3 Memory 1760 bit Up to 10 000 erase/write cycles 10 years non-volatile data retention Memory Lock functionality 32-bit password feature 2.4 Supported standards Full compliant to ISO 18000-2 2.5 Security features 48-bit Unique Item Identification (UII) 2.6 Delivery types Sawn, gold-bumped 8 wafer HVSON2 SOT-1122 3. Applications Industrial applications Casino gambling 4. Ordering information Table 1. Ordering information Type number Package Name Description Type Version HTMS1301FUG/AM Wafer sawn, megabumped wafer, 150 m, 8 inch, UV HITAG ISO 18000, - 210pF HTMS8301FUG/AM Wafer sawn, megabumped wafer, 150 m, 8 inch, UV HITAG ISO 18000, - 280pF HTMS1301FTB/AF XSON3 plastic extremely thin small outline package no HITAG ISO 18000, SOT1122 leads 4 terminals body 1 x 1.45 x 0.5 mm 210pF HTMS8301FTB/AF XSON3 plastic extremely thin small outline package no HITAG ISO 18000, SOT1122 leads 4 terminals body 1 x 1.45 x 0.5 mm 280pF HTMS1301FTK/AF HVSON2 plastic thermal enhanced very thin small outline HITAG ISO 18000, SOT899-1 package no leads 2 terminals body 3 x 2 x 210pF 0.85 mm HTMS8301FTK/AF HVSON2 plastic thermal enhanced very thin small outline HITAG ISO 18000, SOT899-1 package no leads 2 terminals body 3 x 2 x 280pF 0.85 mm 184430 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3.0 18 March 2010 PUBLIC 184430 2 of 44