X-On Electronics has gained recognition as a prominent supplier of LPC2294HBD144/01,551 across the USA, India, Europe, Australia, and various other global locations. LPC2294HBD144/01,551 are a product manufactured by NXP. We provide cost-effective solutions for LPC2294HBD144/01,551, ensuring timely deliveries around the world.

LPC2294HBD144/01,551 NXP

LPC2294HBD144/01,551 electronic component of NXP
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Part No. LPC2294HBD144/01,551
Manufacturer: NXP
Category: Unclassified
Description: MCU 16-bit/32-bit LPC2000 ARM7TDMI-S RISC 256KB Flash 1.8V/3.3V 144-Pin LQFP Tray
Datasheet: LPC2294HBD144/01,551 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
60: USD 24.7939 ea
Line Total: USD 1487.63 
Availability - 0
MOQ: 60  Multiples: 60
Pack Size: 60
Availability Price Quantity
0
Ship by Fri. 10 Jan to Thu. 16 Jan
MOQ : 60
Multiples : 60
60 : USD 24.7939

   
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We are delighted to provide the LPC2294HBD144/01,551 from our NXP manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LPC2294HBD144/01,551 and other electronic components in the NXP manufacturer and beyond.

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LPC2292/2294 16/32-bit ARM microcontrollers 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface Rev. 8 8 June 2011 Product data sheet 1. General description The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. With their 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, 2/4 (LPC2294) advanced CAN channels, PWM channels and up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications as well as medical systems and fault-tolerant maintenance buses. The number of available GPIOs ranges from 76 (with external memory) through 112 (single-chip). With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications. Remark: Throughout the data sheet, the term LPC2292/2294 will apply to devices with and without the /00 or /01 suffix. The suffixes /00 and /01 will be used to differentiate from other devices only when necessary. 2. Features and benefits 2.1 Key features brought by LPC2292/2294/01 devices Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original device. They also allow for a port pin to be read at any time regardless of its function. Dedicated result registers for ADC(s) reduce interrupt overhead. The ADC pads are 5 V tolerant when configured for digital I/O function(s). UART0/1 include fractional baud rate generator, auto-bauding capabilities and handshake flow-control fully implemented in hardware. Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats. SPI programmable data length and master mode enhancement. Diversified Code Read Protection (CRP) enables different security levels to be implemented. This feature is available in LPC2292/2294/00 devices as well. General purpose timers can operate as external event counters. 2.2 Key features common for all devices 16/32-bit ARM7TDMI-S microcontroller in a LQFP144 package.LPC2292/2294 NXP Semiconductors 16/32-bit ARM microcontrollers with external memory interface 16 kB on-chip static RAM and 256 kB on-chip flash program memory. 128-bit wide interface/accelerator enables high-speed 60 MHz operation. In-System Programming/In-Application Programming (ISP/IAP) via on-chip bootloader software. Single flash sector or full chip erase in 400 ms and programming of 256 B in 1 ms. EmbeddedICE-RT and Embedded Trace interfaces offer real-time debugging with the on-chip RealMonitor software as well as high-speed real-time tracing of instruction execution. Two/four (LPC2292/2294) interconnected CAN interfaces with advanced acceptance 2 filters. Additional serial interfaces include two UARTs (16C550), Fast I C-bus (400 kbit/s) and two SPIs. Eight channel 10-bit ADC with conversion time as low as 2.44 s. Two 32-bit timers (with four capture and four compare channels), PWM unit (six outputs), Real-Time Clock (RTC), and watchdog. Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses. Configurable external memory interface with up to four banks, each up to 16 MB and 8/16/32-bit data width. Up to 112 general purpose I/O pins (5 V tolerant). Up to nine edge/level sensitive external interrupt pins available. 60 MHz maximum CPU clock available from programmable on-chip PLL with settling time of 100 s. The on-chip crystal oscillator should have an operating range of 1 MHz to 25 MHz. Power saving modes include Idle and Power-down. Processor wake-up from Power-down mode via external interrupt. Individual enable/disable of peripheral functions for power optimization. Dual power supply: CPU operating voltage range of 1.65 V to 1.95 V (1.8 V 0.15 V). I/O power supply range of 3.0 V to 3.6 V (3.3 V 10 %) with 5 V tolerant I/O pads. 3. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC2292FBD144/01 LQFP144 plastic low profile quad flat package SOT486-1 144 leads body 20 20 1.4 mm LPC2292FET144/00 TFBGA144 plastic thin fine-pitch ball grid array package SOT569-2 144 balls body 12 12 0.8 mm LPC2292FET144/01 TFBGA144 plastic thin fine-pitch ball grid array package SOT569-2 144 balls body 12 12 0.8 mm LPC2292FET144/G TFBGA144 plastic thin fine-pitch ball grid array package SOT569-2 144 balls body 12 12 0.8 mm LPC2292 2294 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 8 June 2011 2 of 54

Tariff Desc

8542310001
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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