Document Number: MC33662 Rev. 8.0, 12/2018 ISO 17987/LIN 2.x/SAEJ2602-2 LIN Physical Layer 33662 The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and LINCELL actuators when all the features of CAN are not required. The three 33662 versions are designed to operate at different maximum baud rates. The 33662LEF and 33662BLEF, and the 33662SEF and 33662BSEF, offer a normal baud rate (20 kbps), and the 33662JEF and 33662BJEF, a slow baud rate (10 kbps). They integrate a fast baud rate (above 100 kbps), as reported by the RXD pin for test and programming modes. They provide excellent EMC (Electromagnetic Compatibility) and Radiated Emission performance, ESD (Electrostatic Discharge) robustness, and safe behavior, in the event of a LIN bus short-to-ground, or a LIN bus leakage during low- power mode. This device is powered by SMARTMOS technology. Features Operational from a V of 7.0 to 18 V DC, functional up to 27 V DC, EF SUFFIX (PB-FREE) SUP 98ASB42564B and handles 40 V during Load Dump 8-PIN SOICN Compliant with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 and ISO 17987-4:2016 (12 V) Active bus wave shaping, offering excellent radiated emission Applications performance Automotive Market: Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus, Body electronics (BCM, gateway, roof, door, 20 kV on the WAKE pin, and 25 kV on the VSUP pin lighting, HVAC) Very high immunity against electromagnetic interference Powertrain (EMS, start & stop), BMS Low standby current in Sleep mode Safety & Chassis (TPMS, seat belt) Overtemperature protection Local and remote Wake-up capability reported by the RXD pin Fast baud rate selection reported by RXD pin 5.0 V and 3.3 V compatible digital inputs without any required external components Pin-to-pin compatible with TJA1021 V BAT 33662 VSUP WAKE CAN SBC or Regulator V DD EN INH 12 V RXD MCU TXD LIN LIN Interface 5.0 V or 3.3 V GND Figure 1. 33662 Master LIN Bus Simplified Application DiagramDEVICE VARIATIONS Table 1. Device Variations Part No. Temperature Range (T ) Package (Add an R2 suffix for Tape and Reel Maximum Baud Rate A orders) (1) MC33662LEF 20 kbps MC33662BLEF (1) 20 kbps with restricted limits for MC33662SEF - 40 to 125 C 8 SOICN transmitter and receiver symmetry MC33662BSEF (1) MC33662JEF 10 kbps MC33662BJEF Notes 1. In Sleep mode, the total module current consumption may be higher than expected if the external pull-up resistor on the RxD pin is implemented. There may be an unexpected glitch on RxD as INH goes low. 33662 2