MC35XS3400DHFK NXP

NXP Semiconductors Document Number: MC35XS3400 Rev. 11.0, 8/2018 Technical Data Quad high-side switch (quad 35 mOhm) 35XS3400 The 35XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (quad 35 mOhm) can control four DS(on) separate 28 W bulbs, and/or LEDs. Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew rate improves electromagnetic compatibility (EMC) HIGH-SIDE SWITCH behavior. Additionally, each output has its own parallel input or SPI control for pulse- width modulation (PWM) control. The 35XS3400 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide functionality of the outputs in case of MCU damage. This device is powered by SMARTMOS technology. Features Four protected 35 m high-side switches (at 25 C) Operating voltage range of 6.0 V to 20 V with standby current < 5.0 A, extended mode from 4.0 V to 28 V FK SUFFIX (PB-FREE) 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy chain 98ARL10596D capability 24-PIN PQFN PWM module using external clock or calibratable internal oscillator with programmable outputs delay management Smart overcurrent shutdown, severe short-circuit, overtemperature protection with time limited autoretry, and Fail-safe mode in case of MCU damage Output OFF or ON openload detection compliant to bulbs or LEDs and short to battery detection Analog current feedback with selectable ratio and board temperature feedback V V V V V DD DD PWR DD PWR 35XS3400 VDD VPWR HS0 WAKE LOAD I/O FS SCLK SCLK CS CS HS1 SI SO LOAD I/O RST SI SO MCU HS2 I/O IN0 LOAD I/O IN1 I/O IN2 I/O IN3 HS3 A/D CSNS LOAD FSI GND GND Figure 1. 35XS3400 simplified application diagram 2018 NXP B.V.Table of Contents 1 Orderable parts 3 2 Device variations . 3 3 Internal block diagram . 4 4 Pin connections 5 5 Electrical characteristics 7 5.1 Maximum ratings 7 5.2 Static electrical characteristics . 8 5.3 Dynamic electrical characteristics 12 5.4 TIming diagrams . 17 6 Functional description 20 6.1 Introduction . 20 6.2 Functional pin description 20 6.3 Functional internal block description 22 7 Functional device operation 23 7.1 SPI protocol description . 23 7.2 Operational modes . 23 7.3 Protection and diagnostic features . 28 7.4 Logic commands and registers 32 8 Typical applications 41 9 Packaging . 42 9.1 Soldering information . 42 9.2 Package dimensions 43 10 Additional documentation 47 10.1Thermal addendum (Rev 2.0) . 47 11 Revision history . 52 35XS3400 2 NXP Semiconductors