X-On Electronics has gained recognition as a prominent supplier of MC35XS3400DHFK Power Switch ICs - Power Distribution across the USA, India, Europe, Australia, and various other global locations. MC35XS3400DHFK Power Switch ICs - Power Distribution are a product manufactured by NXP. We provide cost-effective solutions for Power Switch ICs - Power Distribution, ensuring timely deliveries around the world.

MC35XS3400DHFK NXP

MC35XS3400DHFK electronic component of NXP
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Part No.MC35XS3400DHFK
Manufacturer: NXP
Category: Power Switch ICs - Power Distribution
Description: Power Switch Hi Side 6A Automotive 24-Pin Power QFN EP Tray
Datasheet: MC35XS3400DHFK Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 8.499 ea
Line Total: USD 8.5 
Availability - 22
Ship by Mon. 18 Nov to Wed. 20 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
22
Ship by Mon. 18 Nov to Wed. 20 Nov
MOQ : 1
Multiples : 1
1 : USD 8.499
10 : USD 7.8191
25 : USD 7.4519
100 : USD 6.6631
250 : USD 6.364
500 : USD 6.0105
840 : USD 5.3169
2520 : USD 5.3169
5040 : USD 5.1674

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Number of Outputs
Maximum Operating Temperature
Mounting Style
Output Current
Supply Current - Max
Brand
Switch Type
Interface Type
Package Type
Pin Count
Input Voltage
Operating Temperature Min
Operating Temperature Classification
Rad Hardened
Power Switch Family
Power Switch On Resistance
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We are delighted to provide the MC35XS3400DHFK from our Power Switch ICs - Power Distribution category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MC35XS3400DHFK and other electronic components in the Power Switch ICs - Power Distribution category and beyond.

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NXP Semiconductors Document Number: MC35XS3400 Rev. 11.0, 8/2018 Technical Data Quad high-side switch (quad 35 mOhm) 35XS3400 The 35XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (quad 35 mOhm) can control four DS(on) separate 28 W bulbs, and/or LEDs. Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew rate improves electromagnetic compatibility (EMC) HIGH-SIDE SWITCH behavior. Additionally, each output has its own parallel input or SPI control for pulse- width modulation (PWM) control. The 35XS3400 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide functionality of the outputs in case of MCU damage. This device is powered by SMARTMOS technology. Features Four protected 35 m high-side switches (at 25 C) Operating voltage range of 6.0 V to 20 V with standby current < 5.0 A, extended mode from 4.0 V to 28 V FK SUFFIX (PB-FREE) 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy chain 98ARL10596D capability 24-PIN PQFN PWM module using external clock or calibratable internal oscillator with programmable outputs delay management Smart overcurrent shutdown, severe short-circuit, overtemperature protection with time limited autoretry, and Fail-safe mode in case of MCU damage Output OFF or ON openload detection compliant to bulbs or LEDs and short to battery detection Analog current feedback with selectable ratio and board temperature feedback V V V V V DD DD PWR DD PWR 35XS3400 VDD VPWR HS0 WAKE LOAD I/O FS SCLK SCLK CS CS HS1 SI SO LOAD I/O RST SI SO MCU HS2 I/O IN0 LOAD I/O IN1 I/O IN2 I/O IN3 HS3 A/D CSNS LOAD FSI GND GND Figure 1. 35XS3400 simplified application diagram 2018 NXP B.V.Table of Contents 1 Orderable parts 3 2 Device variations . 3 3 Internal block diagram . 4 4 Pin connections 5 5 Electrical characteristics 7 5.1 Maximum ratings 7 5.2 Static electrical characteristics . 8 5.3 Dynamic electrical characteristics 12 5.4 TIming diagrams . 17 6 Functional description 20 6.1 Introduction . 20 6.2 Functional pin description 20 6.3 Functional internal block description 22 7 Functional device operation 23 7.1 SPI protocol description . 23 7.2 Operational modes . 23 7.3 Protection and diagnostic features . 28 7.4 Logic commands and registers 32 8 Typical applications 41 9 Packaging . 42 9.1 Soldering information . 42 9.2 Package dimensions 43 10 Additional documentation 47 10.1Thermal addendum (Rev 2.0) . 47 11 Revision history . 52 35XS3400 2 NXP Semiconductors

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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