Document Number: MC35XS3400 Freescale Semiconductor Rev. 10.0, 8/2013 Advance Information Quad High Side Switch 35XS3400 (Quad 35 mOhm) The 35XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (quad DS(ON) 35 mOhm) can control four separate 28 W bulbs, and/or LEDs. HIGH SIDE SWITCH Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew rate improves electromagnetic compatibility (EMC) behavior. Additionally, each output has its own parallel input or SPI control for pulse-width modulation (PWM) control. The 35XS3400 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide functionality of the outputs in case of MCU damage. This device is powered by SMARTMOS technology. Features FK SUFFIX (PB-FREE) Four protected 35 m high side switches (at 25 C) 98ARL10596D Operating voltage range of 6.0 V to 20 V with standby current < 24-PIN PQFN 5.0 A, extended mode from 4.0 V to 28 V 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting ORDERING INFORMATION with daisy chain capability PWM module using external clock or calibratable internal Device oscillator with programmable outputs delay management (for Tape and Reel Temperature Package orders add an R2 Range (T ) Smart over-current shutdown, severe short-circuit, over- A suffix to the part) temperature protection with time limited autoretry, and Fail-safe mode in case of MCU damage MC35XS3400CHFK Output OFF or ON OpenLoad detection compliant to bulbs or - 40 to 125C 24 PQFN MC35XS3400DHFK LEDs and short to battery detection Analog current feedback with selectable ratio and board temperature feedback V V V V V DD DD PWR DD PWR 35XS3400 VDD VPWR HS0 WAKE I/O FS LOAD SCLK SCLK CS CS HS1 SI SO LOAD I/O RST SO SI MCU HS2 I/O IN0 LOAD I/O IN1 I/O IN2 I/O IN3 HS3 A/D CSNS LOAD FSI GND GND Figure 1. 35XS3400 Simplified Application Diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. Freescale Semiconductor, Inc., 2008 - 2013. All rights reserved.DEVICE VARIATIONS DEVICE VARIATIONS Table 1. Device Variations Characteristic Symbol Min Typ Max Unit Wake Input Clamp Voltage, I < 2.5 mA V V CL(WAKE) CL(WAKE) 35XS3400CHFK 18 25 32 35XS3400DHFK 20 27 35 Fault Detection Blanking Time t s FAULT 35XS3400CHFK - 5.0 20 35XS3400DHFK - 5.0 10 Output Shutdown Delay Time t s DETECT 35XS3400CHFK - 7.0 30 35XS3400DHFK - 7.0 20 (1) OpenLoad detection time in OFF state t s OLOFF 35XS3400CHFK and 35XS3400DHFK 170 212 270 (2) (3) Peak Package Reflow Temperature During Reflow , T Note 3 C PPRT Notes 1. Guaranteed by design. 2. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 3. Freescales Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics. 35XS3400 Analog Integrated Circuit Device Data 2 Freescale Semiconductor