Document Number MC56F837XXDS NXP Semiconductors Rev. 2.2, 01/2021 Data Sheet: Technical Data MC56F837XXDS MC56F837xx Supports MC56F837xx and MC56F837xxA Features Communication interfaces Up to three high-speed queued SCI (QSCI) modules This family of digital signal controllers (DSCs) is with LIN slave functionality based on the 32-bit 56800EX core. On a single chip, Up to two queued SPI (QSPI) modules each device combines the processing power of a DSP Two I2C/SMBus ports and the functionality of an MCU, with a flexible set of One FlexCAN module, with Flexible Data-rate peripherals to support many target applications: (CAN-FD) supported Industrial control One USB2.0 controller with integrated PHY Home appliances General-purpose inverters PWM and Timers Smart sensors, fire and security systems Two high resolution eFlexPWM modules with up to Switched-mode power supply and power 2x8 PWM outputs, including 2x8 channels with management 312ps resolution NanoEdge placement Power distribution systems Two 16-bit quad timers (2 x 4 16-bit timers) Motor control (ACIM, BLDC, PMSM, SR, stepper) Two Periodic Interval Timers (PITs) Uninterruptible power supplies (UPS) Security and integrity Solar inverter Cyclic Redundancy Check (CRC) generator Medical monitoring applications Windowed Computer operating properly (COP) DSC based on 32-bit 56800EX core watchdog Up to 100 MIPS at 100 MHz core frequency External Watchdog Monitor (EWM) DSP and MCU functionality in a unified, C-efficient Clocks architecture On-chip relaxation oscillators: 200 kHz, and 48 On-chip memory MHz IRC Up to 2128 KB dual partition flash memory with Crystal / resonator oscillator ECC protection and partition swap function System Up to 64 KB data/program RAM Integrated power-on reset (POR) and low-voltage Both on-chip flash memory and RAM can be interrupt (LVI) and brown-out reset module mapped into both program and data memory spaces Inter-Module Crossbar and Event Generator 32 KB boot ROM supports boot from SCI, I2C and JTAG/enhanced on-chip emulation (EOnCE) for CAN unobtrusive, real-time debugging Analog Operating characteristics Two high-speed, 8-ch external and 2-ch internal, 12- Single supply: 2.7 V to 3.6 V bit ADCs with dynamic x1, x2, and x4 5 Vtolerant I/O (except for 3.3 V RESET B and programmable amplifier USB DP/USB DM pins) Four analog comparators with integrated 8-bit DAC Operation ambient temperature (V): -40 to 105C references Operation ambient temperature (M): -40 to 125C Up to two 12-bit digital-to-analog converters (DAC) On-chip temperature sensors 100-pin LQFP, 80-pin LQFP, and 64-pin LQFP packages AEC-Q100 Qualified available for MC56F837xxA NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Overview............................................................................................3 7.8 Definition: Typical value........................................................ 41 1.1 Product Family........................................................................ 3 7.9 Typical value conditions......................................................... 42 1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........4 8 Ratings................................................................................................43 1.3 Operation Parameters.............................................................. 5 8.1 Thermal handling ratings........................................................ 43 1.4 Interrupt Controller................................................................. 5 8.2 Moisture handling ratings........................................................43 1.5 Peripheral highlights............................................................... 6 8.3 ESD handling ratings.............................................................. 43 1.6 Block diagrams........................................................................12 8.4 Voltage and current operating ratings..................................... 44 2 MC56F83xxx Signal and pin descriptions.........................................15 9 General............................................................................................... 45 3 Signal groups......................................................................................30 9.1 General characteristics............................................................ 45 4 Pinout................................................................................................. 30 9.2 AC electrical characteristics....................................................46 4.1 Signal Multiplexing and Pin Assignments..............................30 9.3 Nonswitching electrical specifications....................................47 4.2 Pinout diagrams.......................................................................33 9.4 Switching specifications..........................................................53 5 Ordering parts.....................................................................................36 9.5 Thermal specifications............................................................ 54 5.1 Determining valid orderable parts...........................................36 10 Peripheral operating requirements and behaviors..............................55 5.2 Part number list....................................................................... 37 10.1 Core modules...........................................................................55 6 Part identification...............................................................................37 10.2 System modules.......................................................................56 6.1 Description.............................................................................. 37 10.3 Clock modules.........................................................................57 6.2 Format..................................................................................... 38 10.4 Memories and memory interfaces........................................... 59 6.3 Fields....................................................................................... 38 10.5 Analog..................................................................................... 61 6.4 Example...................................................................................38 10.6 PWMs and timers....................................................................67 7 Terminology and guidelines...............................................................39 10.7 Communication interfaces.......................................................68 7.1 Definition: Operating requirement.......................................... 39 11 Design Considerations....................................................................... 74 7.2 Definition: Operating behavior............................................... 39 11.1 Thermal design considerations................................................74 7.3 Definition: Attribute................................................................39 11.2 Electrical design considerations.............................................. 75 7.4 Definition: Rating....................................................................40 11.3 Power-on Reset design considerations....................................77 7.5 Result of exceeding a rating.................................................... 40 12 Obtaining package dimensions.......................................................... 78 7.6 Relationship between ratings and operating requirements......40 13 Product documentation.......................................................................78 7.7 Guidelines for ratings and operating requirements................. 41 14 Revision history................................................................................. 78 MC56F837xx, Rev. 2.2, 01/2021 2 NXP Semiconductors