Document Number: MCIMX27EC NXP Semiconductors Rev. 2, 3/2019 Data Sheet: Technical Data i.MX27 and i.MX27L Package Information Plastic Package i.MX27 and i.MX27L Case 1816-01 (MAPBGA404) Case 1931-04 Data Sheet (MAPBGA-473) Multimedia Applications Processor Ordering Information See Table 1 on page 4 for ordering information. Contents 1 Introduction 1 Introduction 1 1.1 Features . 2 The i.MX27 and i.MX27L (MCIMX27/MX27L) 1.2 Block Diagram . 3 1.3 Ordering Information 4 multimedia applications processors represents the next 2 Functional Description and Application Information . 4 step in low-power, high-performance application 2.1 ARM926 Microprocessor Core Platform . 4 processors. Unless otherwise specified, the material in 2.2 Module Inventory . 5 2.3 Module Descriptions 9 this data sheet is applicable to both the i.MX27 and 3 Signal Descriptions . 26 i.MX27L processors and referred to singularly 3.1 Power-Up Sequence . 35 3.2 EMI Pins Multiplexing 35 throughout this document as i.MX27. 4 Electrical Characteristics . 40 4.1 i.MX27/i.MX27L Chip-Level Conditions . 40 The i.MX27L does not include the following features: 4.2 Module-Level Electrical Specifications . 43 ATA-6 HDD Interface, Memory Stick Pro, VPU: 4.3 Timing Diagrams 53 MPEG-4/ H.263/H.264 HW encoder/decoder, and 5 Package Information and Pinout 108 5.1 Package Outline Drawing eMMA (PrP processing, CSC, deblock, dering). (17 mm 17 mm404 pin) 108 5.2 Pin Assignments (17 mm 17 mm404 pin) . 112 Based on an ARM926EJ-S microprocessor core, the 5.3 Package Outline Drawing i.MX27/27L processor provides the performance with (19 mm 19 mm473 pin) 131 low power consumption required by modern digital 5.4 Pin Assignments (19 mm 19 mm473 pin) . 132 7 Revision History 153 devices such as the following: Feature-rich cellular phones Portable media player s and mobile gaming machines Personal digital assista nts (PDAs) and wireless PDAs 2008-2019 NXP B.V. NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.Introduction Portable DVD players Digital cameras The i.MX27/MX27L processor features the advanced and power-efficient ARM926EJ-S core operating at speeds up to 400 MHz, and is optimized for minimal power consumption using the most advanced techniques for power saving (for example, DPTC, power gating, and clock gating). With 90 nm technology and dual Vt, the i.MX27/MX27L device provides the optimal performance vs. leakage current balance. The performance of the i.MX27/MX27L processors are both boosted by an on-chip cache system, and features peripheral devices, such as an MPEG-4, H.263, an H.264 video codec (up to D1720 x 486 30 FPS), LCD, eMMA lt, and CMOS Sensor Interface controllers. The i.MX27/MX27L processors supports connections to various types of external memories, such as 266-MHz DDR, NAND Flash, NOR Flash, SDRAM, and SRAM. The i.MX27/MX27L devices can be connected to a variety of external devices using technology, such as high-speed USBOTG 2.0, the Advanced Technology Attachment (ATA), Multimedia/Secure Data (MMC/SDIO), and CompactFlash. NOTE The i.MX27L does not support the ATA-6 HDD interface. 1.1 Features The i.MX27/MX27L processors are targeted for video and voice over-IP (V2IP) and smart remote controllers. It also provides low-power solutions for any high-performance and demanding multimedia and graphics applications. The systems include the following features: Multi-standard video codec (i.MX27 only) MPEG-4 part-II simple profile encoding/decoding H.264/AVC baseline profile encoding/decoding H.263 P3 encoding/decoding Multi-party call: one stream encoding and two streams decoding simultaneously Multi-format: encodes MPEG-4 bitstream, and decodes H.264 bitstream simultaneously On-the-fly video processing that reduces system memory load (for example, the power-efficient viewfinder application with no involvement of either the memory system or the Arm CPU) Advanced power management (i.MX27/27L) Dynamic process and temperature compensation Multiple clock and power domains Independent gating of power domains Multiple communication and expansion ports i.MX27 and i.MX27L Data Sheet, Rev. 2, 3/2019 2 NXP Semiconductors