X-On Electronics has gained recognition as a prominent supplier of MCIMX537CVV8CR2 Microprocessors - MPU across the USA, India, Europe, Australia, and various other global locations. MCIMX537CVV8CR2 Microprocessors - MPU are a product manufactured by NXP. We provide cost-effective solutions for Microprocessors - MPU, ensuring timely deliveries around the world.

MCIMX537CVV8CR2 NXP

MCIMX537CVV8CR2 electronic component of NXP
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Part No.MCIMX537CVV8CR2
Manufacturer: NXP
Category: Microprocessors - MPU
Description: SOC i.MX53 ARM Cortex A8 0.06um 529-Pin TEBGA II T/R
Datasheet: MCIMX537CVV8CR2 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
750: USD 30.676 ea
Line Total: USD 23007 
Availability - 0
MOQ: 750  Multiples: 750
Pack Size: 750
   
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We are delighted to provide the MCIMX537CVV8CR2 from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MCIMX537CVV8CR2 and other electronic components in the Microprocessors - MPU category and beyond.

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Document Number: IMX53IEC Freescale Semiconductor Rev. 7, 05/2015 Data Sheet: Technical Data MCIMX53xC i.MX53 Applications Package Information Plastic Package Processors for Industrial Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Products Silicon Version 2.1 Ordering Information See Table 1 on page 2 1. Introduction . 1 1 Introduction 1.1. Functional Part Differences and Ordering Information . 2 The i.MX53 processor features ARM Cortex-A8 1.2. Features . 3 2. Architectural Overview . 6 core, which operates at clock speeds as high as 2.1. Block Diagram 6 800 MHz. It provides DDR2/LVDDR2-800, 3. Modules List . 7 3.1. Special Signal Considerations . 16 LPDDR2-800, or DDR3-800 DRAM memories. 4. Electrical Characteristics 16 4.1. Chip-Level Conditions . 16 The flexibility of the i.MX53 architecture allows for its 4.2. Power Supply Requirements and Restrictions . 23 use in a wide variety of applications. As the heart of the 4.3. I/O DC Parameters 26 4.4. Output Buffer Impedance Characteristics 32 application chipset, the i.MX53 processor provides all 4.5. I/O AC Parameters 36 the interfaces for connecting peripherals, such as 4.6. System Modules Timing 43 WLAN, Bluetooth, GPS, hard drive, camera sensors, 4.7. External Peripheral Interfaces Parameters . 65 4.8. XTAL Electrical Specifications 141 and dual displays. 5. Boot Mode Configuration . 142 5.1. Boot Mode Configuration Pins 142 Features of the i.MX53 processor include the following: 5.2. Boot Devices Interfaces Allocation . 143 Applications processorThe i.MX53xD 5.3. Power Setup During Boot 144 6. Package Information and Contact Assignments . 145 processors boost the capabilities of high-tier 6.1. 19x19 mm Package Information . 145 portable applications by satisfying the ever 7. Revision History 170 increasing MIPS needs of operating systems and games. Freescales Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction, allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as audio decode. 2011-2015 Freescale Semiconductor, Inc. All rights reserved.Introduction Multilevel memory systemThe multilevel memory system of the i.MX53 is based on the L1 instruction and data caches, L2 cache, internal and external memory. The i.MX53 supports many types of external memory devices, including DDR2, low voltage DDR2, LPDDR2, DDR3, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND, and managed NAND including eMMC up to rev 4.4. Smart speed technologyThe i.MX53 device has power management throughout the IC that enables the rich suite of multimedia features and peripherals to consume minimum power in both active and various low power modes. Smart speed technology enables the designer to deliver a feature-rich product requiring levels of power far lower than industry expectations. Multimedia powerhouseThe multimedia performance of the i.MX53 processor ARM core is boosted by a multilevel cache system, Neon (including advanced SIMD, 32-bit single-precision floating point support) and vector floating point coprocessors. The system is further enhanced by a multi-standard hardware video codec, autonomous image processing unit (IPU), and a programmable smart DMA (SDMA) controller. Powerful graphics acceleration The i.MX53 processors provide two independent, integrated graphics processing units: an OpenGL ES 2.0 3D graphics accelerator (33 Mtri/s, 200 Mpix/s, and 800 Mpix/s z-plane performance) and an OpenVG 1.1 2D graphics accelerator (200 Mpix/s). Interface flexibilityThe i.MX53 processor supports connection to a variety of interfaces, including LCD controller for two displays and CMOS sensor interface, high-speed USB on-the-go with PHY, plus three high-speed USB hosts, multiple expansion card ports (high-speed MMC/SDIO host and others), 10/100 Ethernet controller, and a variety of other popular interfaces 2 2 (PATA, UART, I C, and I S serial audio, among others). Advanced securityThe i.MX53 processors deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. For detailed information about the i.MX53 security features contact a Freescale representative. The i.MX53 application processor is a follow-on to the i.MX51, with improved performance, power efficiency, and multimedia capabilities. 1.1 Functional Part Differences and Ordering Information shows the functional differences between the different parts in the i.MX53 family. Table 1 provides ordering information. Table 1. Ordering Information 1 Part Number Mask Set CPU Frequency Notes Package MCIMX537CVV8C 3N78C 800 MHz 19 x 19 mm, 0.8 mm pitch BGA Case TEPBGA-2 1 Case TEPBGA-2 is RoHS compliant, lead-free MSL (moisture sensitivity level) 3. i.MX53 Applications Processors for Industrial Products, Rev. 7 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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