MKW30Z160VHM4 NXP

Document Number MKW40Z160 NXP Semiconductors Rev. 1.2, 05/2018 Data Sheet: Advance Information MKW40Z160 MKW30Z160 MKW20Z160 MKW40Z/30Z/20Z Data Sheet A Bluetooth Low Energy and IEEE 802.15.4 System on a Chip (SoC) Supports the following: MKW40Z160VHT4, MKW30Z160VHM4, MKW20Z160VHT4 Key features Human-machine interface Touch Sensing Input Multi-Standard Radio General-purpose input/output 2.4 GHz Bluetooth Low Energy version 4.1 compliant Analog modules IEEE Standard 802.15.4 2011 compliant 16-bit Analog-to-Digital Converter (ADC) Typical Receiver Sensitivity (BLE) = -91 dBm 12-bit Digital-to-Analog Converter (DAC) Typical Receiver Sensitivity (802.15.4) = -102 dBm 6-bit High Speed Analog Comparator (CMP) Programmable Transmitter Output Power: -18 dBm Timers to +5 dBm 16-bit low-power timer (LPTMR) Low external component counts for low cost 3 Timers Modules(TPM): One 4 channels TPM and application Two 2 channels TPMs MCU and Memories Programmable Interrupt Timer (PIT) Up to 48 MHz ARM Cortex-M0+ core Real-Time Clock (RTC) On-chip 160 KB Flash memory Communication interfaces On-chip 20 KB SRAM 2 SPI modules Low Power Consumption 2 I2C modules Typical Rx Current: 6.5 mA (DCDC in buck mode, Low Power UART module 3.6 V supply) Carrier Modulator Timer (CMT) Typical Tx Current: 8.4 mA (DCDC in buck mode, Security 3.6 V supply) for a 0 dBm output AES-128 Accelerator (AESA) Low Power Mode (VLLS0) Current: 206 nA True Random Number Generator (TRNG) Clocks Operating Characteristics 32 MHz Crystal Oscillator DCDC Converter supporting Buck, Boost, and 32 kHz Crystal Oscillator Bypass modes System peripherals Temperature range (ambient): -40 to 85C Nine low-power modes to provide power optimization based on application requirements DCDC Converter supporting Buck, Boost, and Bypass modes DMA Controller COP Software watchdog SWD Interface and Micro Trace buffer Bit Manipulation Engine (BME) This document contains information on a pre-production product. Specifications and pre-production information herein are subject to change without notice.Table of Contents 1 Ordering information......................................................................... 4 6.2.8 Capacitance attributes.................................................. 33 2 Feature Descriptions...........................................................................4 6.3 Switching electrical specifications............................................ 34 2.1 Block diagram............................................................................4 6.3.1 Device clock specifications..........................................34 2.2 Radio features............................................................................ 5 6.3.2 General switching specifications................................. 34 2.3 Microcontroller features............................................................ 6 6.4 Thermal specifications...............................................................35 2.4 System features..........................................................................7 6.4.1 Thermal operating requirements.................................. 35 2.5 Peripheral features..................................................................... 9 6.4.2 Thermal attributes........................................................ 35 3 Transceiver Description..................................................................... 13 6.5 Peripheral operating requirements and behaviors......................36 3.1 Key Specifications.....................................................................14 6.5.1 Core modules............................................................... 36 3.2 Frequency Plan for Bluetooth Low Energy...............................14 6.5.2 System modules........................................................... 37 3.3 Frequency Plan for 802.15.4 and 802.15.4j (MBAN)............... 16 6.5.3 Clock modules............................................................. 38 3.4 Transceiver Functions................................................................17 6.5.4 Memories and memory interfaces................................39 4 System and Power Management........................................................ 17 6.5.5 Security and integrity modules.................................... 41 4.1 Power Management................................................................... 17 6.5.6 Analog..........................................................................41 4.1.1 DCDC Converter......................................................... 18 6.5.7 Timers.......................................................................... 50 4.2 Modes of Operation................................................................... 18 6.5.8 Communication interfaces........................................... 50 4.2.1 Power modes................................................................18 6.5.9 Human-machine interfaces (HMI)...............................55 5 Transceiver Electrical Characteristics................................................21 7 KW40Z Electrical Characteristics......................................................55 5.1 Recommended radio operating conditions................................ 21 7.1 DCDC Converter Recommended Electrical Characteristics..... 56 5.2 Receiver Feature Summary........................................................21 7.2 Ratings....................................................................................... 57 5.3 Transmit and PLL Feature Summary........................................ 23 7.2.1 Thermal handling ratings............................................. 57 6 MCU Electrical Characteristics..........................................................24 7.2.2 Moisture handling ratings............................................ 58 6.1 AC electrical characteristics...................................................... 24 7.2.3 ESD handling ratings................................................... 58 6.2 Nonswitching electrical specifications...................................... 24 7.2.4 Voltage and current operating ratings..........................58 6.2.1 Voltage and current operating requirements................24 8 Pin Diagrams and Pin Assignments................................................... 59 6.2.2 LVD and POR operating requirements........................25 8.1 Pinouts....................................................................................... 59 6.2.3 Voltage and current operating behaviors..................... 26 8.2 Signal Multiplexing and Pin Assignments................................ 60 6.2.4 Power mode transition operating behaviors.................27 9 Package Information.......................................................................... 63 6.2.5 Power consumption operating behaviors..................... 27 9.1 Obtaining package dimensions..................................................63 6.2.6 Diagram: Typical IDD RUN operating behavior........32 10 Revision History.................................................................................63 6.2.7 Designing with radiated emissions in mind.................33 MKW40Z/30Z/20Z Data Sheet, Rev. 1.2, 05/2018 2 NXP Semiconductors