X-On Electronics has gained recognition as a prominent supplier of MSC8256SVT1000B Digital Signal Processors & Controllers - DSP, DSC across the USA, India, Europe, Australia, and various other global locations. MSC8256SVT1000B Digital Signal Processors & Controllers - DSP, DSC are a product manufactured by NXP. We provide cost-effective solutions for Digital Signal Processors & Controllers - DSP, DSC, ensuring timely deliveries around the world.

MSC8256SVT1000B NXP

MSC8256SVT1000B electronic component of NXP
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Part No.MSC8256SVT1000B
Manufacturer: NXP
Category: Digital Signal Processors & Controllers - DSP, DSC
Description: Digital Signal Processors & Controllers - DSP, DSC DSPStarcore6-core R2.1
Datasheet: MSC8256SVT1000B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 251.75 ea
Line Total: USD 251.75

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 17 Jul to Tue. 23 Jul
MOQ : 1
Multiples : 1
1 : USD 279.2483

   
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Document Number: MSC8256 Freescale Semiconductor Rev. 6, 7/2013 Data Sheet MSC8256 Six-Core Digital Signal Processor FC-PBGA783 29 mm 29 mm Six StarCore SC3850 DSP subsystems, each with an SC3850 High-speed serial interface that supports two Serial RapidIO DSP core, 32 Kbyte L1 instruction cache, 32 Kbyte L1 data cache, interfaces, one PCI Express interface, and two SGMII interfaces unified 512 Kbyte L2 cache configurable as M2 memory in (multiplexed). The Serial RapidIO interfaces support 1x/4x 64 Kbyte increments, memory management unit (MMU), operation up to 3.125 Gbaud with a single messaging unit and two extended programmable interrupt controller (EPIC), two DMA units. The PCI Express controller supports 32- and 64-bit general-purpose 32-bit timers, debug and profiling support, addressing, x4, x2, and x1 link. low-power Wait, Stop, and power-down processing modes, and QUICC Engine technology subsystem with dual RISC ECC/EDC support. processors, 48 Kbyte multi-master RAM, 48 Kbyte instruction Chip-level arbitration and switching system (CLASS) that RAM, supporting two communication controllers for two Gigabit provides full fabric non-blocking arbitration between the cores Ethernet interfaces (RGMII or SGMII), to offload scheduling and other initiators and the M2 memory, shared M3 memory, tasks from the DSP cores, and an SPI. DDR SRAM controllers, device configuration control and status I/O Interrupt Concentrator consolidates all chip maskable registers, and other targets. interrupt and non-maskable interrupt sources and routes then to 1056 Kbyte 128-bit wide M3 memory, 1024 Kbytes of which can INT OUT, NMI OUT, and the cores. be turned off to save power. UART that permits full-duplex operation with a bit rate of up to 96 Kbyte boot ROM. 6.25 Mbps. Three input clocks (one global and two differential). Two general-purpose 32-bit timers for RTOS support per SC3850 Five PLLs (three global and two Serial RapidIO PLLs). core, four timer modules with four 16-bit fully programmable Two DDR controllers with up to a 400 MHz clock (800 MHz data timers, and eight software watchdog timers (SWT). rate), 64/32 bit data bus, supporting up to a total 2 Gbyte in up to Eight programmable hardware semaphores. four banks (two per controller) and support for DDR2 and DDR3. Up to 32 virtual interrupts and a virtual NMI asserted by simple DMA controller with 32 unidirectional channels supporting 16 write access. 2 memory-to-memory channels with up to 1024 buffer descriptors I C interface. per channel, and programmable priority, buffer, and multiplexing Up to 32 GPIO ports, sixteen of which can be configured as configuration. It is optimized for DDR SDRAM. external interrupts. Up to four independent TDM modules with programmable word Boot interface options include Ethernet, Serial RapidIO interface, 2 size (2, 4, 8, or 16-bit), hardware-base A-law/-law conversion, I C, and SPI. up to 62.5 Mbps data rate for each TDM link, and with glueless Supports standard JTAG interface interface to E1 or T1 framers that can interface with Low power CMOS design, with low-power standby and H-MVIP/H.110 devices, TSI, and codecs such as AC-97. power-down modes, and optimized power-management circuitry. 45 nm SOI CMOS technology. 20082013 Freescale Semiconductor, Inc. All rights reserved.Table of Contents 1 Pin Assignment .4 Figure 11.DDR2 and DDR3 SDRAM Interface Input Timing 1.1 FC-PBGA Ball Layout Diagram 4 Diagram . 38 1.2 Signal List By Ball Location .5 Figure 12.MCK to MDQS Timing 39 2 Electrical Characteristics 24 Figure 13.DDR SDRAM Output Timing . 40 2.1 Maximum Ratings .24 Figure 14.DDR2 and DDR3 Controller Bus AC Test Load . 40 2.2 Recommended Operating Conditions 25 Figure 15.DDR2 and DDR3 SDRAM Differential Timing 2.3 Thermal Characteristics 26 Specifications 40 2.4 CLKIN Requirements 26 Figure 16.Differential Measurement Points for Rise and Fall Time 42 2.5 DC Electrical Characteristics 26 Figure 17.Single-Ended Measurement Points for Rise and Fall Time 2.6 AC Timing Characteristics .37 Matching 42 3 Hardware Design Considerations 56 Figure 18.Single Frequency Sinusoidal Jitter Limits . 46 3.1 Power Supply Ramp-Up Sequence 56 Figure 19.SGMII AC Test/Measurement Load 46 3.2 PLL Power Supply Design Considerations 59 Figure 20.TDM Receive Signals 48 3.3 Clock and Timing Signal Board Layout Considerations 60 Figure 21.TDM Transmit Signals 49 3.4 SGMII AC-Coupled Serial Link Connection Example 60 Figure 22.TDM AC Test Load 49 3.5 Connectivity Guidelines 61 Figure 23.Timer AC Test Load 50 3.6 Guide to Selecting Connections for Remote Power Figure 24.MII Management Interface Timing . 51 Supply Sensing .64 Figure 25.RGMII AC Timing and Multiplexing 52 4 Ordering Information 67 Figure 26.SPI AC Test Load . 53 5 Package Information 68 Figure 27.SPI AC Timing in Slave Mode (External Clock) . 53 6 Product Documentation .69 Figure 28.SPI AC Timing in Master Mode (Internal Clock) 53 7 Revision History .69 Figure 29.Test Clock Input Timing . 54 Figure 30.Boundary Scan (JTAG) Timing . 55 Figure 31.Test Access Port Timing 55 List of Figures Figure 32.TRST Timing . 55 Figure 1. MSC8256 Block Diagram 3 Figure 33.Supply Ramp-Up Sequence with V Ramping Before DD Figure 2. StarCore SC3850 DSP Subsystem Block Diagram 3 V and CLKIN Starting With V . 56 DDIO DDIO Figure 3. MSC8256 FC-PBGA Package, Top View 4 Figure 34.Supply Ramp-Up Sequence . 58 Figure 4. Differential Voltage Definitions for Transmitter or Figure 35.Reset Connection in Functional Application . 58 Receiver 29 Figure 36.Reset Connection in Debugger Application 58 Figure 5. Receiver of SerDes Reference Clocks . 30 Figure 37.PLL Supplies . 59 Figure 6. SerDes Transmitter and Receiver Reference Circuits 31 Figure 38.SerDes PLL Supplies 60 Figure 7. Differential Reference Clock Input DC Requirements Figure 39.4-Wire AC-Coupled SGMII Serial Link Connection (External DC-Coupled) . 32 Example . 60 Figure 8. Differential Reference Clock Input DC Requirements Figure 40.MSC8256 Mechanical Information, 783-ball FC-PBGA (External AC-Coupled) . 32 Package . 68 Figure 9. Single-Ended Reference Clock Input DC Requirements 33 Figure 10.SGMII Transmitter DC Measurement Circuit . 35 MSC8256 Six-Core Digital Signal Processor Data Sheet, Rev. 6 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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