Document Number: WCT1011DS NXP Semiconductors Data Sheet Rev. 0 09/2016 , Overview Description WCT1011DS The WCT1011 is a wireless power transmitter controller that Features integrates all required functions for the WPC Qi compliant wireless power transmitter design. It is an intelligent device Compliant with the latest version Wireless Power that works with the NXP touch sensing technology or uses Consortium (WPC) power class 0 specification power periodically analog PING to detect a mobile device for transmitter design charging while gaining super low standby power. Once the Supports wide transmitter DC input voltage ranging mobile device is detected, the WCT1011 controls the power from 4.2 V, typically 12 V and 19 V transfer by adjusting the operation frequency and duty cycle, Integrated digital demodulation or switching topology, or adjusting the phase difference of Supports two-way communication, transmitter to the power stage according to message packets sent by receiver by FSK and receiver to transmitter by ASK mobile device. Supports all types of receiver modulation strategies (AC capacitor, AC resistor, and DC resistor) In order to maximize the design freedom and product Supports Q factor detection and calibrated power loss differentiation, the WCT1011 supports the extended power based Foreign Object Detection (FOD) Framework profile consumer power transmitter design (WPC MP-Ax types or customization) by using operation frequency and Supports low standby power duty cycle control, phase difference control, and topology Supports various power control techniques: operation switch by software based solutions, which can support frequency control, duty cycle control, phase difference wireless charging with both extended power profile power control and topology switch receiver and baseline power profile power receiver. In LED for system status indication addition, the easy-to-use FreeMASTER GUI tool has Over-voltage/current/temperature protection configuration, calibration, and debugging functions to Software-based solution to provide maximum design provide the user-friendly design experience and reduce freedom and product differentiation time-to-market. FreeMASTER GUI tool to enable configuration, calibration, and debugging The WCT1011 includes a digital demodulation module to reduce the external components, an FSK modulation module Applications to support two-way communication, a protection module to handle the over-voltage/current/temperature protection, and Extended Power Profile Power Transmitter an FOD module to protect from overheating by misplaced Extended power profile consumer power transmitter metallic foreign objects. It also handles any abnormal solution with operation frequency and duty cycle condition and operational status and provides control, phase difference control, and topology switch comprehensive indicator outputs for robust system design. (WPC MP-Ax types or customer properties) Wireless Charging System Functional Diagram Contents 1 Absolute Maximum Ratings .................................................................................................................... 5 1.1 Electrical operating ratings...................................................................................................................................... 5 1.2 Thermal handling ratings ........................................................................................................................................ 6 1.3 ESD handling ratings ............................................................................................................................................... 6 1.4 Moisture handling ratings ....................................................................................................................................... 6 2 Electrical Characteristics ......................................................................................................................... 7 2.1 General characteristics ............................................................................................................................................ 7 2.2 Device characteristics .............................................................................................................................................. 9 2.3 Thermal operating characteristics ......................................................................................................................... 14 3 Typical Performance Characteristics ............................................................................................... 15 3.1 System efficiency .................................................................................................................................................. 15 3.2 Standby power ...................................................................................................................................................... 15 3.3 Digital demodulation ............................................................................................................................................ 16 3.4 Two-way communication ...................................................................................................................................... 16 3.5 Foreign object detection ....................................................................................................................................... 16 4 Device Information ................................................................................................................................. 17 4.1 Functional block diagram ...................................................................................................................................... 17 4.2 Pinout diagram ..................................................................................................................................................... 18 4.3 Pin function description ........................................................................................................................................ 18 4.4 Ordering information ............................................................................................................................................ 20 4.5 Package outline drawing ....................................................................................................................................... 20 WCT1011DS, Rev. 0, 09/201 2 NXP Semiconductors