PCF8523
Real-Time Clock (RTC) and calendar
Rev. 7 28 April 2015 Product data sheet
1. General description
1
The PCF8523 is a CMOS Real-Time Clock (RTC) and calendar optimized for low power
2
consumption. Data is transferred serially via the I C-bus with a maximum data rate of
1000 kbit/s. Alarm and timer functions are available with the possibility to generate a
wake-up signal on an interrupt pin. An offset register allows fine-tuning of the clock. The
PCF8523 has a backup battery switch-over circuit, which detects power failures and
automatically switches to the battery supply when a power failure occurs.
For a selection of NXP Real-Time Clocks, see Table 56 on page 68
2. Features and benefits
Provides year, month, day, weekday, hours, minutes, and seconds based on a
32.768 kHz quartz crystal
Resolution: seconds to years
Clock operating voltage: 1.0 V to 5.5 V
Low backup current: typical 150 nA at V = 3.0 V and T =25 C
DD amb
2 2
2 line bidirectional 1 MHz Fast-mode Plus (Fm+) I C interface, read D1h, write D0h
Battery backup input pin and switch-over circuit
Freely programmable timer and alarm with interrupt capability
Selectable integrated oscillator load capacitors for C =7pF or C = 12.5 pF
L L
Oscillator stop detection function
Internal Power-On Reset (POR)
Open-drain interrupt or clock output pins
Programmable offset register for frequency adjustment
3. Applications
Time keeping application
Battery powered devices
Metering
1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 22.
2
2. Devices with other I C-bus slave addresses can be produced on request.PCF8523
NXP Semiconductors
Real-Time Clock (RTC) and calendar
4. Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
PCF8523T SO8 plastic small outline package; 8 leads; SOT96-1
body width 3.9 mm
PCF8523TK HVSON8 plastic thermal enhanced very thin small outline SOT909-1
package; no leads; 8 terminals;
body 4 4 0.85 mm
PCF8523TS TSSOP14 plastic thin shrink small outline package; 14 leads; SOT402-1
body width 4.4 mm
PCF8523U bare die 12 bumps (6-6) PCF8523U
4.1 Ordering options
Table 2. Ordering options
Product type Sales item (12NC) Orderable part IC Delivery form
number number revision
PCF8523T/1 935293581118 PCF8523T/1,118 1 tape and reel, 13 inch
PCF8523TK/1 935293573118 PCF8523TK/1,118 1 tape and reel, 13 inch
PCF8523TS/1 935291196112 PCF8523TS/1,112 1 tube
935291196118 PCF8523TS/1,118 1 tape and reel, 13 inch
[1]
PCF8523U/12AA/1 935293887005 PCF8523U/12AA/1,00 1 chips with bumps , sawn wafer on Film
Frame Carrier (FFC)
[1] Bump hardness see Table 53.
Table 3. PCF8523U wafer information
Type number Wafer thickness Wafer diameter FFC for wafer size Marking of bad die
PCF8523U/12AA/1 200 m 6 inch 8 inch wafer mapping
5. Marking
Table 4. Marking codes
Type number Marking code
PCF8523T/1 8523T
PCF8523TK/1 8523
PCF8523TS/1 8523TS
PCF8523U/12AA/1 PC8523-1
PCF8523 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 7 28 April 2015 2 of 78