P1010NSN5DFB NXP

Freescale Semiconductor Document Number: P1010EC Data Sheet: Advance Information Rev. 4, 05/2014 P1010 P1010 QorIQ Integrated Processor Hardware TePBGA1-425 19 mm x 19 mm Specifications The following list provides an overview of the P1010 feature DDR3/DDR3L SDRAM memory controller supports set: 32-bit without ECC and 16-bit with ECC Programmable interrupt controller (PIC) compliant with High-performance 32-bit Book E-enhanced core based on OpenPIC standard the Power Architecture technology: One 4-channel DMA controller 36-bit physical addressing 2 Two I C interfaces Double-precision floating-point support Four UART interfaces 32-Kbyte L1 instruction cache and 32-Kbyte L1 data Two FlexCAN (version 2.0b) interfaces cache Integrated Flash controller (IFC) 400- to 1000-MHz clock frequency TDM 256-Kbyte L2 cache with ECC. Also configurable as 16 general-purpose I/O signals SRAM and stashing memory Operating temperature (Ta - T ) range: 0105 C (standard) Secure boot capability j and 40 C to 105 C (extended) Three enhanced three-speed Ethernet controllers (eTSECs) 19 19 mm 425-ball wirebond TePBGA-1 package with 10/100/1000 Mbps support 0.8 mm pitch TCP/IP acceleration, quality of service, and classification capabilities IEEE Std 1588 support RGMII, SGMII eTSEC1 supports both RGMII/SGMII interfaces and eTSEC2, eTSEC3 support SGMII interface High-speed interfaces supporting the following multiplexing options: Two PCI Express 1.1 interfaces Two SATA Revision 2.0 interfaces Six lanes of high-speed serial interfaces to be shared between PCI Express, SATA, and SGMII High-speed USB controller (USB 2.0) Host and device support On-chip USB 2.0 high-speed PHY Enhanced host controller interface (EHCI) ULPI interface Enhanced secure digital host controller (SD/MMC) Enhanced serial peripheral interface (eSPI) Integrated security engine (ULE CAAM) Protocol support includes DES, AES, RNG, CRC, MDE, PKE, SHA, and MD5. This document contains information on a new product. Specifications and information herein are subject to change without notice. Freescale Semiconductor, Inc., 2011-2014. All rights reserved.Table of Contents 1 Pin assignments and reset states .4 2.22 PCI Express . 80 1.1 Ball layout diagrams 4 2.23 Serial ATA (SATA) 84 1.2 Pinout assignments 11 3 Hardware design considerations 88 2 Electrical characteristics .22 3.1 System clocking 88 2.1 Overall DC electrical characteristics .22 3.2 Supply power default setting 91 2.2 Power sequencing .26 3.3 Power supply design and sequencing . 92 2.3 Power-down Requirements 27 3.4 Decoupling recommendations . 93 2.4 Reset Initialization .27 3.5 SerDes block power supply decoupling 2.5 Power-on ramp rate 28 recommendations 93 2.6 Power characteristics 29 3.6 Connection recommendations . 93 2.7 Input clocks 31 3.7 Pull-up and pull-down resistor requirements 93 2.8 DDR3, and DDR3L SDRAM controller .33 3.8 Output buffer DC impedance . 94 2.9 eSPI .41 3.9 Configuration pin muxing . 94 2.10 DUART .42 3.10 JTAG configuration signals . 95 2.11 Ethernet: Enhanced Three-Speed Ethernet (eTSEC) .43 3.11 Guidelines for high-speed interface termination . 97 2.12 USB 54 3.12 Thermal 98 2.13 Integrated flash controller .58 4 Package information 100 2.14 Enhanced secure digital host controller (eSDHC) 62 4.1 Package parameters for P1010 . 100 2.15 Programmable Interrupt Controller (PIC) 4.2 Mechanical dimensions of P1010 WB-TePBGA 100 specifications 64 5 Security fuse processor 101 2.16 JTAG .65 6 Ordering information 102 2 2.17 I C .67 6.1 Part marking . 102 2.18 GPIO .69 7 Product documentation 102 2.19 FlexCAN 71 8 Revision history 103 2.20 TDM .72 2.21 High-Speed Serial Interfaces (HSSI) 74 P1010 QorIQ Integrated Processor Hardware Specifications, Rev. 4 2 Freescale Semiconductor