X-On Electronics has gained recognition as a prominent supplier of P1012NXE2HFB Microprocessors - MPU across the USA, India, Europe, Australia, and various other global locations. P1012NXE2HFB Microprocessors - MPU are a product manufactured by NXP. We provide cost-effective solutions for Microprocessors - MPU, ensuring timely deliveries around the world.

P1012NXE2HFB NXP

P1012NXE2HFB electronic component of NXP
P1012NXE2HFB NXP
P1012NXE2HFB Microprocessors - MPU
P1012NXE2HFB  Semiconductors

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Part No. P1012NXE2HFB
Manufacturer: NXP
Category: Microprocessors - MPU
Description: MPU QorIQ P1012 45nm 800MHz 689-Pin TEBGA II Tray
Datasheet: P1012NXE2HFB Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 144.939
5 : USD 141.9804
10 : USD 140.5485
N/A

Obsolete
   
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We are delighted to provide the P1012NXE2HFB from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the P1012NXE2HFB and other electronic components in the Microprocessors - MPU category and beyond.

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Freescale Semiconductor Document Number: P1012EC Data Sheet: Technical Data Rev. 1, 03/2012 P1012 P1012 QorIQ Integrated Processor Hardware Specifications One four-channel DMA controller The following list provides an overview of the feature set: 2 Two I C controllers, DUART, timers A high-performance 32-bit core, built on Power Enhanced local bus controller (eLBC) Architecture technology: QUICC Engine block 36-bit physical addressing Operating junction temperature (T ) range: 0125C and Double-precision floating-point support j 40C to 125C (industrial specification) 32 Kbyte L1 instruction cache and 32 Kbyte L1 data 31 31 mm 689-pin WB-TePBGA II (wire bond cache for each core temperature-enhanced plastic BGA) 533 MHz to 800 MHz clock frequency 256 Kbyte L2 cache with ECC. Also configurable as SRAM and stashing memory. Three 10/100/1000 Mbps enhanced three-speed Ethernet controllers (eTSECs) TCP/IP acceleration, quality of service, and classification capabilities IEEE 1588 support Lossless flow control MII, RMII, RGMII, SGMII High-speed interfaces supporting various multiplexing options: Four SerDes upto 2.5 GHz/lane multiplexed across controllers Two PCI Express interfaces Two SGMII interfaces High-Speed USB controller (USB 2.0) Host and device support Enhanced host controller interface (EHCI) ULPI interface to PHY Enhanced secure digital host controller (SD/MMC) Enhanced Serial peripheral interface (eSPI) Integrated security engine Protocol support includes ARC4, 3DES, AES, RSA/ECC, RNG, single-pass SSL/TLS XOR acceleration 32-bit DDR2/DDR3 SDRAM memory controller with ECC support Programmable interrupt controller (PIC) compliant with OpenPIC standard 2012 Freescale Semiconductor, Inc. All rights reserved.Table of Contents 1 Pin Assignments and Reset States 4 2.16 JTAG 81 1.1 Ball Layout Diagrams .4 2.17 I2C 83 1.2 Pinout Assignments 9 2.18 High-Speed Serial Interfaces (HSSI) 85 2 Electrical Characteristics 33 2.19 PCI Express . 91 2.1 Overall DC Electrical Characteristics 33 3 QUICC Engine Block Specifications . 96 2.2 Power Sequencing 36 3.1 Ethernet Interface 96 2.3 Power Down Requirements .37 3.2 HDLC, BISYNC, T ransparent, an d S ynchronous UART 2.4 RESET Initialization .37 Interfaces . 99 2.5 Power-on Ramp Rate 38 3.3 TDM/SI . 102 2.6 Power Characteristics 38 3.4 UTOPIA Interface . 103 2.7 Input Clocks .40 3.5 SPI Interface . 105 2.8 DDR2 and DDR3 SDRAM 44 3.6 GPIO . 107 2.9 eSPI .53 4 Thermal 108 2.10 DUART .55 4.1 Thermal Characteristics . 108 2.11 Ethernet: E nhanced T hree-Speed Ethernet (eTSEC) 4.2 Temperature Diode 109 (10/100/1000Mbps)MII/RMII/RGMII/SGMII El ectrical 5 Package Information 109 Characteristics .56 5.1 Package Parameters for the P1012 WB-TePBGA II . 109 2.12 USB 72 5.2 Ordering Information . 112 2.13 Enhanced Local Bus .75 6 Product Documentation 112 2.14 Enhanced Secure Digital Host Controller (eSDHC) .78 7 Revision History . 113 2.15 Programmable Interrupt Controller (PIC) Specifications80 P1012 QorIQ Integrated Processor Hardware Specifications, Rev. 1 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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