PCF2123TS/1,118 NXP

PCF2123 SPI Real time clock/calendar Rev. 6 15 July 2013 Product data sheet 1. General description 1 The PCF2123 is a CMOS Real-Time Clock (RTC) and calendar optimized for low power applications. Data is transferred serially via a Serial Peripheral Interface (SPI-bus) with a maximum data rate of 6.25 Mbit/s. An alarm and timer function is also available providing the possibility to generate a wake-up signal on an interrupt pin. An offset register allows fine tuning of the clock. 2. Features and benefits Real time clock provides year, month, day, weekday, hours, minutes, and seconds based on a 32.768 kHz quartz crystal Low backup current while running: typical 100 nA at V = 2.0 V and T =25 C DD amb Resolution: seconds to years Watchdog functionality Freely programmable timer and alarm with interrupt capability Clock operating voltage: 1.1 V to 5.5 V 3 line SPI-bus with separate, but combinable data input and output Serial interface at V = 1.8 V to 5.5 V DD 1 second or 1 minute interrupt output Integrated oscillator load capacitors for C =7pF L Internal Power-On Reset (POR) Open-drain interrupt and clock output pins Programmable offset register for frequency adjustment 3. Applications Time keeping application Battery powered devices Metering High duration timers Daily alarms Low standby power applications 1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 22.PCF2123 NXP Semiconductors SPI Real time clock/calendar 4. Ordering information Table 1. Ordering information Type number Package Name Description Version PCF2123BS HVQFN16 plastic thermal enhanced very thin quad flat package SOT758-1 no leads 16 terminals body 3 3 0.85 mm PCF2123TS TSSOP14 plastic thin shrink small outline package 14 leads SOT402-1 body width 4.4 mm PCF2123U/10AA wire bond die 12 bonding pads PCF2123U/10 PCF2123U/12AA WLCSP12 wafer level chip size package 12 bumps PCF2123U/12 PCF2123U/12HA WLCSP12 wafer level chip size package 12 bumps PCF2123U/12 PCF2123U/5GA wire bond die 12 bonding pads PCF2123U/10 4.1 Ordering options Table 2. Ordering options Product type number Sales item (12NC) Orderable part IC Delivery form number revision PCF2123BS/1 935286382512 PCF2123BS/1,512 1 tube, dry pack 935286382518 PCF2123BS/1,518 1 tape and reel, 13 inch, dry pack PCF2123TS/1 935286384112 PCF2123TS/1,112 1 tube 935286384118 PCF2123TS/1,118 1 tape and reel, 13 inch PCF2123U/10AA/1 935287542005 PCF2123U/10AA/1,00 1 sawn 6 inch wafer on Film Frame Carrier (FFC) for 6 inch wafer PCF2123U/12AA/1 935290647005 PCF2123U/12AA/1,00 1 sawn 6 inch wafer on plastic Film Frame Carrier (FFC) for 8 inch wafer PCF2123U/12HA/1 935292966005 PCF2123U/12HA/1,00 1 sawn 6 inch wafer on plastic Film Frame Carrier (FFC) for 8 inch wafer PCF2123U/5GA/1 935295429015 PCF2123U/5GA/1,015 1 wafer, unsawn 5. Marking Table 3. Marking codes Type number Marking code PCF2123BS 123 PCF2123TS PCF2123 PCF2123U/10AA PC2123-1 PCF2123U/12AA PC2123-1 PCF2123U/12HA PC2123-1 PCF2123U/5GA PC2123-1 PCF2123 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved. Product data sheet Rev. 6 15 July 2013 2 of 64