PCF8883 Capacitive touch/proximity switch with auto-calibration, large voltage operating range, and very low power consumption Rev. 4.1 14 September 2016 Product data sheet 1. General description The integrated circuit PCF8883 is a capacitive touch and proximity switch that uses a patented (EDISEN) digital method to detect a change in capacitance on a remote sensing plate. Changes in the static capacitance (as opposed to dynamic capacitance changes) are automatically compensated using continuous auto-calibration. Remote sensing plates 1 (e.g. conductive foil) can be connected directly to the IC or remotely using a coaxial cable. 2. Features and benefits Dynamic proximity switch Digital processing method Adjustable sensitivity, can be made very high Adjustable response time Wide input capacitance range (10 pF to 60 pF) Automatic calibration A large distance (several meters) between the sensing plate and the IC is possible Open-drain output (P-type MOSFET, external load between pin and ground) Designed for battery powered applications (I = 3 A, typical) DD Output configurable as push-button, toggle, or pulse Wide voltage operating range (V = 3 V to 9 V) DD Large temperature operating range (T = 40 C to +85 C) amb Internal voltage regulator Available in SOIC8 and wafer level chip-size package 3. Applications Proximity detection Proximity sensing in Mobile phones Portable entertainment units Switch for medical applications Switch for use in explosive environments Vandal proof switches Transportation: Switches in or under upholstery, leather, handles, mats, and glass 1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 21.PCF8883 NXP Semiconductors Capacitive touch/proximity switch with auto-calibration Buildings: switch in or under carpets, glass, or tiles Sanitary applications: use of standard metal sanitary parts (e.g. tap) as switch Hermetically sealed keys on a keyboard 4. Ordering information Table 1. Ordering information Type number Package Name Description Version PCF8883T SOIC8 plastic small outline package 8 leads PCF8883T body width 3.9 mm PCF8883US WLCSP8 wafer level chip-size package 8 bumps PCF8883US 4.1 Ordering options Table 2. Ordering options Product type number Orderable part number Sales item Delivery form IC (12NC) revision PCF8883T/1 PCF8883T/1,118 935289766118 tape and reel, 13 inch 1 PCF8883US/7EA/1 PCF8883US/7EA/1Y 935300777518 dry pack, tape and reel, 13 inch 1 5. Marking Table 3. Marking codes Product type number Marking code PCF8883T PCF8883 PCF8883US PC 8883-1 PCF8883 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved. Product data sheet Rev. 4.1 14 September 2016 2 of 35